MC9S12D64CFUE vs MC9S12B64MFUE Comparison
Detailed side-by-side comparison of MC9S12D64CFUE by NXP Semiconductors and MC9S12B64MFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S12D64CFUE | MC9S12B64MFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $16.20 | $9.10 |
| Core | HCS12 (16-bit CISC) | HCS12 (CISC) |
| Maximum CPU Frequency | 25 MHz | — |
| Program Memory (Flash) | 64 KB (64K x 8) | — |
| RAM | 4 KB | — |
| EEPROM | 1 KB | — |
| Number of I/O | 59 | — |
| ADC | 8-channel, 10-bit | — |
| Supply Voltage | 2.5 V / 5 V | 5 V |
| Package | 80-QFP (14 x 14 mm) | 80-QFP (14 x 14 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Communication Peripherals | 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) | — |
| Timers | ECT, TIM, PWM, PIT | [DATA_NEEDED: timer module count] |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code) |
| Packaging | Tray | — |
| Series | — | HCS12 |
| Data Bus Width | — | 16-bit |
| Maximum Clock Frequency | — | 25 MHz |
| Program Memory Size (Flash) | — | 64 KB (64K x 8) |
| RAM Size | — | 2 KB |
| Pin Count | — | 80 |
| Communication Interfaces | — | CAN, SCI (UART), SPI |
| A/D Channels | — | [DATA_NEEDED: A/D channel count] |
| A/D Resolution | — | [DATA_NEEDED: A/D resolution] |
| PWM Channels | — | [DATA_NEEDED: PWM channel count] |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| Debug Interface | — | BDM (Background Debug Mode) |
| Lead-Free / Lead Content | — | [DATA_NEEDED: lead-free status] |