MC9S12D64CFUE vs MC9S12B64MFUE Vergleich
Detaillierter Direktvergleich von MC9S12D64CFUE von NXP Semiconductors und MC9S12B64MFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S12D64CFUE | MC9S12B64MFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16,20 | $9,10 |
| Core | HCS12 (16-bit CISC) | HCS12 (CISC) |
| Maximum CPU Frequency | 25 MHz | — |
| Program Memory (Flash) | 64 KB (64K x 8) | — |
| RAM | 4 KB | — |
| EEPROM | 1 KB | — |
| Number of I/O | 59 | — |
| ADC | 8-channel, 10-bit | — |
| Versorgungsspannung | 2.5 V / 5 V | 5 V |
| Gehäuse | 80-QFP (14 x 14 mm) | 80-QFP (14 x 14 mm) |
| Montageart | Surface Mount | Surface Mount |
| Communication Peripherals | 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) | — |
| Timers | ECT, TIM, PWM, PIT | [DATA_NEEDED: timer module count] |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code) |
| Packaging | Tray | — |
| Series | — | HCS12 |
| Datenbusbreite | — | 16-bit |
| Maximale Taktfrequenz | — | 25 MHz |
| Program Memory Size (Flash) | — | 64 KB (64K x 8) |
| RAM Size | — | 2 KB |
| Pin-Anzahl | — | 80 |
| Communication Interfaces | — | CAN, SCI (UART), SPI |
| A/D Channels | — | [DATA_NEEDED: A/D channel count] |
| A/D Resolution | — | [DATA_NEEDED: A/D resolution] |
| PWM Channels | — | [DATA_NEEDED: PWM channel count] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| Debug Interface | — | BDM (Background Debug Mode) |
| Lead-Free / Lead Content | — | [DATA_NEEDED: lead-free status] |