MC9S12DG256CMPV vs MC9S12DG256CCPV Comparison

Detailed side-by-side comparison of MC9S12DG256CMPV by NXP Semiconductors and MC9S12DG256CCPV by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12DG256CMPV MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV ✓ Active
NXP Semiconductors
MC9S12DG256CCPV MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV Nrnd

Specification Comparison

Parameter MC9S12DG256CMPV MC9S12DG256CCPV
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active NRND
Stock Status In Stock In Stock
Unit Price (USD) $11.90 $18.20
Core HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) HCS12 (16-bit CISC)
Maximum CPU Clock 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) —
Program Memory (Flash) 256 KB (256K x 8) 256 KB (256K x 8)
RAM 12 KB —
EEPROM 4 KB —
Operating Voltage 2.5 V / 5 V (single supply with on-chip regulator) —
I/O Voltage 5 V tolerant —
ADC 10-bit, 8 channels 8-channel, 10-bit
CAN Modules (MSCAN) 1 x MSCAN 2.0A/B-compatible —
SCI / SPI 2 x SCI, 1 x SPI —
Timers Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI Enhanced Capture Timer (ECT) + watchdog
BDLC (J1850) 1 module (VPW) —
Package 112-LQFP (20 x 20 mm, 0.65 mm pitch) —
Pin Count 112 —
Operating Temperature -40 C to +85 C (automotive AEC-Q100) —
AEC-Q100 Qualification Qualified (automotive grade) —
Mounting Type Surface Mount (gull-wing) Surface Mount
RoHS Status [DATA_NEEDED: RoHS status - not present in verified snippet] Compliant
Maximum CPU/Bus Frequency — 25 MHz
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Lines — 91
Supply Voltage Range — 2.97 V to 5.5 V (single 5 V supply)
Operating Temperature Range — -40 °C to +85 °C (industrial)
Package / Case — 112-LQFP (20 x 20 mm)
PWM Channels — 8 channels
Communication Interfaces — 2 x SCI, 2 x SPI, I2C, CAN 2.0
On-chip Debug — Background Debug Mode (BDM)
MSL Level — 3 (168 hours, JEDEC J-STD-020)

Datasheets & Resources

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