MC9S12DG256CMPV vs MC9S12DG256CCPV Vergleich

Detaillierter Direktvergleich von MC9S12DG256CMPV von NXP Semiconductors und MC9S12DG256CCPV von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12DG256CMPV MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV ✓ Aktiv
NXP Semiconductors
MC9S12DG256CCPV MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV Nrnd

Spezifikationsvergleich

Parameter MC9S12DG256CMPV MC9S12DG256CCPV
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $11,90 $18,20
Core HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) HCS12 (16-bit CISC)
Maximum CPU Clock 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) —
Program Memory (Flash) 256 KB (256K x 8) 256 KB (256K x 8)
RAM 12 KB —
EEPROM 4 KB —
Operating Voltage 2.5 V / 5 V (single supply with on-chip regulator) —
I/O Voltage 5 V tolerant —
ADC 10-bit, 8 channels 8-channel, 10-bit
CAN Modules (MSCAN) 1 x MSCAN 2.0A/B-compatible —
SCI / SPI 2 x SCI, 1 x SPI —
Timers Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI Enhanced Capture Timer (ECT) + watchdog
BDLC (J1850) 1 module (VPW) —
Gehäuse 112-LQFP (20 x 20 mm, 0.65 mm pitch) —
Pin-Anzahl 112 —
Betriebstemperatur -40 C to +85 C (automotive AEC-Q100) —
AEC-Q100 Qualification Qualified (automotive grade) —
Montageart Surface Mount (gull-wing) Surface Mount
RoHS-Status [DATA_NEEDED: RoHS status - not present in verified snippet] Compliant
Maximum CPU/Bus Frequency — 25 MHz
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Lines — 91
Supply Voltage Range — 2.97 V to 5.5 V (single 5 V supply)
Betriebstemperaturbereich — -40 °C to +85 °C (industrial)
Gehäuse / Bauform — 112-LQFP (20 x 20 mm)
PWM Channels — 8 channels
Communication Interfaces — 2 x SCI, 2 x SPI, I2C, CAN 2.0
On-chip Debug — Background Debug Mode (BDM)
MSL-Level — 3 (168 hours, JEDEC J-STD-020)

Datenblätter & Ressourcen

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