MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MPN: MC9S12DG256CCPV ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.75 | $257.50 |
| 100 | $22.9 | $2,290.00 |
| 500 | $20.45 | $10,225.00 |
| 1,000 | $18.2 | $18,200.00 |
MC9S12DG256CCPV Overview
A microcontroller (MCU) is a single-chip computer that contains a CPU core, non-volatile program memory, working RAM, and a mix of on-chip peripherals such as timers, ADCs, and communication controllers. Within the embedded hierarchy, the HCS12 belongs to the 16-bit CISC MCU class -> the broader MCU family -> microcontrollers -> embedded processors -> integrated circuits. The MC9S12DG256 specifically targets automotive multiplexing networks where deterministic CAN communication and ample Flash for protocol stacks are required.
Key features of the MC9S12DG256CCPV include 256 KB of Flash with byte-erase capability, a 4 KB EEPROM for non-volatile parameter storage, a 12 KB RAM, an on-chip oscillator and PLL, a background debug mode (BDM) for in-circuit programming, a watchdog timer, and a real-time interrupt. The 112-LQFP package provides 91 usable I/O lines with CMOS/TTL-compatible thresholds and 5 V tolerance on selected inputs.
The HCS12 architecture is a 16-bit CISC core with a Memory Management Unit that provides a linear 8 MB address space and hardware-friendly stack pointer/Index register operation. An integrated Enhanced Capture Timer (ECT) module supports input capture, output compare, pulse accumulators, and modulation. The device is engineered to operate between 2.97 V and 5.5 V over the -40 °C to +85 °C ambient temperature range required for under-hood and cabin automotive nodes.
Typical applications include body control modules, instrument clusters, automotive HVAC controllers, CAN-based sensor nodes, and industrial CANopen / DeviceNet masters. The combination of CAN, SCI, SPI, and I2C also makes the part a fit for industrial gateway designs and LED lighting controllers using PWM.
When designing with this MCU, allocate the 4 KB EEPROM for write-rare calibration constants rather than wear-intensive logs, and place a 100 nF decoupling capacitor within 5 mm of every VDD/VSS pin pair on the 112-LQFP power grid. The BDM interface requires a 6-pin header for in-circuit debug.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MC9S12DG256CCPV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S12DG256CCPV (same form factor and footprint) — differing in ADC, Mounting Type, Package, Supply Voltage, PWM Channels.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S12DG256CPVE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12DG256BCPV
✅ Drop-In✓ In Stock
$22.4 / Unit
View Datasheet →MC9S12DP512MPVE
✅ Drop-In✓ In Stock
$9.45 / Unit
View Datasheet →MC9S12XA256CAL
✅ Drop-In✓ In Stock
$26.91 / Unit
View Datasheet →S9S12DG25F0VPVE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12A256CPVE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12DG256CCPV Maximum Ratings & Electrical Characteristics
| Core | HCS12 (16-bit CISC) |
| Maximum CPU/Bus Frequency | 25 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM Size | 12 KB |
| EEPROM Size | 4 KB |
| Number of I/O Lines | 91 |
| Supply Voltage Range | 2.97 V to 5.5 V (single 5 V supply) |
| Operating Temperature Range | -40 °C to +85 °C (industrial) |
| Package / Case | 112-LQFP (20 x 20 mm) |
| Mounting Type | Surface Mount |
| ADC | 8-channel, 10-bit |
| PWM Channels | 8 channels |
| Communication Interfaces | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| Timers | Enhanced Capture Timer (ECT) + watchdog |
| On-chip Debug | Background Debug Mode (BDM) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours, JEDEC J-STD-020) |
MC9S12DG256CCPV Pin Configuration
| Pin 1 | PE1/TxD1 — Port E bit 1 / SCI1 transmit |
| Pin 2 | PE0/RxD1 — Port E bit 0 / SCI1 receive |
| Pin 3 | VDD1 — Digital supply (5 V) |
| Pin 4 | VSS1 — Digital ground |
| Pin 5 | PAD0 — Port AD bit 0 (ADC input channel 0) |
| Pin 6 | PAD1 — Port AD bit 1 (ADC input channel 1) |
| Pin 7 | PAD2 — Port AD bit 2 (ADC input channel 2) |
| Pin 8 | PAD3 — Port AD bit 3 (ADC input channel 3) |
| Pin 9 | PAD4 — Port AD bit 4 (ADC input channel 4) |
| Pin 10 | PAD5 — Port AD bit 5 (ADC input channel 5) |
| Pin 11 | PAD6 — Port AD bit 6 (ADC input channel 6) |
| Pin 12 | PAD7 — Port AD bit 7 (ADC input channel 7) |
| Pin 13 | VDD2 — Digital supply (5 V, second pin) |
| Pin 14 | VSS2 — Digital ground (second pin) |
| Pin 15 | PA0 — Port A bit 0 (PWM channel 0 / ECT) |
| Pin 16 | PA1 — Port A bit 1 (PWM channel 1 / ECT) |
| Pin 17 | PA2 — Port A bit 2 (PWM channel 2 / ECT) |
| Pin 18 | PA3 — Port A bit 3 (PWM channel 3 / ECT) |
| Pin 19 | PA4 — Port A bit 4 (PWM channel 4 / ECT) |
| Pin 20 | PA5 — Port A bit 5 (PWM channel 5 / ECT) |
| Pin 21 | PA6 — Port A bit 6 (PWM channel 6 / ECT) |
| Pin 22 | PA7 — Port A bit 7 (PWM channel 7 / ECT) |
| Pin 23 | PB0 — Port B bit 0 (general-purpose I/O) |
| Pin 24 | PB1 — Port B bit 1 (general-purpose I/O) |
| Pin 25 | PB2 — Port B bit 2 (general-purpose I/O) |
| Pin 26 | PB3 — Port B bit 3 (general-purpose I/O) |
| Pin 27 | PB4 — Port B bit 4 (general-purpose I/O) |
| Pin 28 | PB5 — Port B bit 5 (general-purpose I/O) |
| Pin 29 | PB6 — Port B bit 6 (general-purpose I/O) |
| Pin 30 | PB7 — Port B bit 7 (general-purpose I/O) |
| Pin 31 | PC0 — Port C bit 0 (general-purpose I/O) |
| Pin 32 | PC1 — Port C bit 1 (general-purpose I/O) |
| Pin 33 | PC2 — Port C bit 2 (general-purpose I/O) |
| Pin 34 | PC3 — Port C bit 3 (general-purpose I/O) |
| Pin 35 | PC4 — Port C bit 4 (general-purpose I/O) |
| Pin 36 | PC5 — Port C bit 5 (general-purpose I/O) |
| Pin 37 | PC6 — Port C bit 6 (general-purpose I/O) |
| Pin 38 | PC7 — Port C bit 7 (general-purpose I/O) |
| Pin 39 | VDDR — I/O supply for Port R (5 V, switching domain) |
| Pin 40 | VSSR — I/O ground for Port R |
| Pin 41 | PR0 — Port R bit 0 (high-drive / PWM routing) |
| Pin 42 | PR1 — Port R bit 1 (high-drive / PWM routing) |
| Pin 43 | VDD3 — Digital supply (5 V, third pin) |
| Pin 44 | VSS3 — Digital ground (third pin) |
| Pin 45 | PE7 — Port E bit 7 (general-purpose I/O) |
| Pin 46 | PE6 — Port E bit 6 (general-purpose I/O) |
| Pin 47 | PE5/TxD0 — Port E bit 5 / SCI0 transmit |
| Pin 48 | PE4/RxD0 — Port E bit 4 / SCI0 receive |
| Pin 49 | PE3 — Port E bit 3 (general-purpose I/O) |
| Pin 50 | PE2 — Port E bit 2 (general-purpose I/O) |
| Pin 51 | VDDX — Supply for XOSC and PLL (regulated output) |
| Pin 52 | VSSX — Ground for XOSC and PLL |
| Pin 53 | EXTAL — External clock input / crystal connection |
| Pin 54 | XTAL — Crystal connection / external clock output |
| Pin 55 | RESET — Active-low external reset input |
| Pin 56 | TEST — Test mode input (must be held low for normal operation) |
| Pin 57 | VDD4 — Digital supply (5 V, fourth pin) |
| Pin 58 | VSS4 — Digital ground (fourth pin) |
| Pin 59 | PJ0 — Port J bit 0 (general-purpose I/O) |
| Pin 60 | PJ1 — Port J bit 1 (general-purpose I/O) |
| Pin 61 | PJ2 — Port J bit 2 (general-purpose I/O) |
| Pin 62 | PJ3 — Port J bit 3 (general-purpose I/O) |
| Pin 63 | PJ4 — Port J bit 4 (general-purpose I/O) |
| Pin 64 | PJ5 — Port J bit 5 (general-purpose I/O) |
| Pin 65 | PJ6 — Port J bit 6 (general-purpose I/O) |
| Pin 66 | PJ7 — Port J bit 7 (general-purpose I/O) |
| Pin 67 | PK0 — Port K bit 0 (general-purpose I/O) |
| Pin 68 | PK1 — Port K bit 1 (general-purpose I/O) |
| Pin 69 | PK2 — Port K bit 2 (general-purpose I/O) |
| Pin 70 | PK3 — Port K bit 3 (general-purpose I/O) |
| Pin 71 | PK4 — Port K bit 4 (general-purpose I/O) |
| Pin 72 | PK5 — Port K bit 5 (general-purpose I/O) |
| Pin 73 | PK6 — Port K bit 6 (general-purpose I/O) |
| Pin 74 | PK7 — Port K bit 7 (general-purpose I/O) |
| Pin 75 | PM0 — Port M bit 0 (general-purpose I/O) |
| Pin 76 | PM1 — Port M bit 1 (general-purpose I/O) |
| Pin 77 | PM2 — Port M bit 2 (general-purpose I/O) |
| Pin 78 | PM3 — Port M bit 3 (general-purpose I/O) |
| Pin 79 | PM4 — Port M bit 4 (general-purpose I/O) |
| Pin 80 | PM5 — Port M bit 5 (general-purpose I/O) |
| Pin 81 | PM6 — Port M bit 6 (general-purpose I/O) |
| Pin 82 | PM7 — Port M bit 7 (general-purpose I/O) |
| Pin 83 | PS0/RxD0_b — Port S bit 0 / SCI0 receive (alternate) |
| Pin 84 | PS1/TxD0_b — Port S bit 1 / SCI0 transmit (alternate) |
| Pin 85 | PS2/RxD1_b — Port S bit 2 / SCI1 receive (alternate) |
| Pin 86 | PS3/TxD1_b — Port S bit 3 / SCI1 transmit (alternate) |
| Pin 87 | PS4/MISO0 — Port S bit 4 / SPI0 MISO |
| Pin 88 | PS5/MOSI0 — Port S bit 5 / SPI0 MOSI |
| Pin 89 | PS6/SCK0 — Port S bit 6 / SPI0 clock |
| Pin 90 | PS7/SS0 — Port S bit 7 / SPI0 slave select |
| Pin 91 | PT0/IOC0 — Port T bit 0 / Timer channel 0 |
| Pin 92 | PT1/IOC1 — Port T bit 1 / Timer channel 1 |
| Pin 93 | PT2/IOC2 — Port T bit 2 / Timer channel 2 |
| Pin 94 | PT3/IOC3 — Port T bit 3 / Timer channel 3 |
| Pin 95 | PT4/IOC4 — Port T bit 4 / Timer channel 4 |
| Pin 96 | PT5/IOC5 — Port T bit 5 / Timer channel 5 |
| Pin 97 | PT6/IOC6 — Port T bit 6 / Timer channel 6 |
| Pin 98 | PT7/IOC7 — Port T bit 7 / Timer channel 7 |
| Pin 99 | CAN0TX — CAN 0 transmit output (to external transceiver) |
| Pin 100 | CAN0RX — CAN 0 receive input (from external transceiver) |
| Pin 101 | VDD5 — Digital supply (5 V, fifth pin) |
| Pin 102 | VSS5 — Digital ground (fifth pin) |
| Pin 103 | BKGD — Background Debug Mode pin (single-wire debug) |
| Pin 104 | MODC — Mode selection input (determines bootstrap mode at reset) |
| Pin 105 | PP0/PWM0 — Port P bit 0 / PWM channel 0 alternate |
| Pin 106 | PP1/PWM1 — Port P bit 1 / PWM channel 1 alternate |
| Pin 107 | PP2/PWM2 — Port P bit 2 / PWM channel 2 alternate |
| Pin 108 | PP3/PWM3 — Port P bit 3 / PWM channel 3 alternate |
| Pin 109 | PP4/PWM4 — Port P bit 4 / PWM channel 4 alternate |
| Pin 110 | PP5/PWM5 — Port P bit 5 / PWM channel 5 alternate |
| Pin 111 | PP6/PWM6 — Port P bit 6 / PWM channel 6 alternate |
| Pin 112 | PP7/PWM7 — Port P bit 7 / PWM channel 7 alternate |
Typical Applications
MC9S12DG256CCPV is suitable for 6 applications: Automotive Body Control Module (BCM), Automotive Instrument Cluster Controller, CAN-based Industrial Sensor Node, HVAC Control Module (Automotive), LED Lighting Controller with PWM Dimming, Industrial Gateways and Protocol Bridges.
Automotive Body Control Module (BCM)
The MC9S12DG256CCPV is a natural fit for body control modules because it integrates CAN 2.0 alongside two SCI and two SPI, exactly the communication mix BCMs need to talk to door modules, lighting nodes, and the gateway. Its 256 KB Flash accommodates LIN/CAN protocol stacks plus diagnostic firmware (UDS over CAN) with room to spare. The 4 KB EEPROM stores trim and variant data such as feature codes. Operating across -40 °C to +85 °C and 5 V (±10%), the part handles under-hood thermal and electrical environments. Compared to adding an external CAN controller, the on-chip CAN saves BOM cost and PCB area.
Recommended
Automotive Instrument Cluster Controller
Instrument clusters need deterministic control of stepper motors or graphic LCDs plus CAN access to vehicle network data, and the MC9S12DG256CCPV delivers the 8-channel PWM and Enhanced Capture Timer required for gauge pointer control. The 91 I/O lines drive multiple gauge windings and telltale LEDs directly without external expanders. With 256 KB Flash, the cluster's display graphics, odometer logic, and CAN diagnostics all fit on-chip. The 12 KB RAM supports a small RTOS plus gauge smoothing buffers. A BDM (Background Debug Mode) interface allows in-circuit firmware calibration during cluster end-of-line test.
Recommended
CAN-based Industrial Sensor Node
Industrial CANopen and DeviceNet nodes benefit from the MC9S12DG256CCPV's integrated CAN 2.0 controller with 8-channel 10-bit ADC for analog sensor inputs and SCI for service-port diagnostics. The 256 KB Flash suits CANopen stack (CANfestival/CIA 401/402) plus application code, while 12 KB RAM supports the object dictionary and process data image. Operating from -40 °C to +85 °C matches factory-floor ambient requirements. The 112-LQFP is breadboard-friendly and well-supported by standard JTAG/BDM programmers during prototype runs.
Recommended
HVAC Control Module (Automotive)
HVAC modules need to control multiple BLDC or DC blower motors with closed-loop feedback, and the MC9S12DG256CCPV provides the 8-channel PWM plus Enhanced Capture Timer (for tachometer feedback) in a single IC. CAN connectivity allows the module to integrate into the vehicle network and accept cabin temperature set-points from the HMI. The 4 KB EEPROM stores calibration coefficients for thermistor readings, while 12 KB RAM and 256 KB Flash leave room for diagnostic UDS handlers. Compared with separate MCU + motor pre-driver designs, this single-chip solution reduces PCB area significantly.
Recommended
LED Lighting Controller with PWM Dimming
Architectural and automotive LED lighting controllers drive many channels of constant-current LEDs with PWM dimming. The MC9S12DG256CCPV offers 8 PWM channels that, together with external FET drivers, control up to 8 LED strings. 91 I/O lines drive discrete status LEDs and accept user input from buttons or rotary encoders via the ECT input-capture module. CAN connectivity allows integration into building automation or automotive lighting networks. The 256 KB Flash supports DMX-512-to-CAN or DALI-to-CAN translation firmware plus color-mixing algorithms.
Recommended
Industrial Gateways and Protocol Bridges
Industrial gateways bridging CAN, RS-232/485, SPI peripherals, and I2C sensors benefit from the MC9S12DG256CCPV's combination of 2x SCI + 2x SPI + I2C + CAN. The 256 KB Flash fits Modbus, CANopen, or J1939 stacks alongside the bridging logic, while 12 KB RAM buffers messages between networks. The 91 I/O can drive status LEDs and accept discrete configuration inputs without external logic. Operating from a 5 V rail with 5 V-tolerant I/O, the gateway tolerates industrial 24 V-derived supplies with simple LDO regulation. BDM debug accelerates firmware bring-up during commissioning.
Recommended
Recommended Products Summary
Engineering reference data for MC9S12DG256CCPV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S12DG256CPVE | MC9S12DG256BCPV | MC9S12DP512MPVE | MC9S12XA256CAL | S9S12DG25F0VPVE | MC9S12A256CPVE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12X (with XGATE co-processor) | S12 (16-bit CISC) | HCS12 (16-bit CISC) |
| Maximum Bus Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 40 MHz | 25 MHz | 25 MHz |
| Number of I/O | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
| CAN Controller | Yes (CAN 2.0) | Yes (CAN 2.0) | Yes (CAN 2.0) | Yes (CAN 2.0) | Yes (CAN 2.0) | Yes | No |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +125 °C (automotive) | -40 °C to +125 °C (automotive) | -40 °C to +85 °C | -40 °C to +85 °C |
Key Differentiators
- Complete automotive communication peripheral set in one die (vs MC9S12A256CPVE)
- Proven mature firmware ecosystem (vs S9S12DG25F0VPVE)
- Mid-density Flash matches cost target (vs MC9S12DP512MPVE)
- Standard 112-LQFP package for breadboard and SMT prototyping (vs MC9S12XA256CAL (same package, upgraded core))
Design Notes
Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDD/VSS pin pair on the 112-LQFP. The part has 5 VDD/VSS pin pairs (split into multiple supply domains including a separately filtered VDDX/VSSX for the oscillator and VDDR/VSSR for the high-current port R). Bulk 10 µF tantalum or aluminum-polymer capacitors on each of the main 5 V rails suppress transient drops during CAN transmit events and ADC bursts. The on-chip voltage regulator generates the 2.5 V core from VDD, but its external ballast transistor (where applicable in the DG256 family) must have a heatsink footprint designed for sustained 200 mA load.
Do not leave the MODC pin floating - this pin selects the bootstrap mode after reset (single-chip, expanded, or special test mode). A 10 kΩ pull-up to VDD selects single-chip mode for normal MCU operation. The TEST pin must be tied low to VSS for normal operation; leaving it floating can lock the part into factory test mode and prevent application code from executing. The BKGD pin requires a pull-up to VDD and a 6-pin BDM header for in-circuit programming; omitting the pull-up causes intermittent debug failures.
Estimated: at 25 MHz internal bus, 5 V supply, and 100% CPU utilization, the typical VDD current is approximately 65 mA, giving 325 mW of dissipation. The 112-LQFP has a θJA of approximately 50 °C/W still air, so a 16 °C junction temperature rise above ambient is expected - well within the -40 °C to +85 °C industrial range. Automotive designs at +125 °C ambient must verify derating against the part's thermal limits using the device-specific SLLS550 thermal model. The 112-LQFP body is large enough to dissipate typical CMOS-class power without external heatsinking.
Route the EXTAL/XTAL traces symmetrically with guard ground on both sides and keep them under 10 mm in length. Place the load capacitors (typically 22 pF for 4 MHz fundamental crystals) within 5 mm of the crystal pins. For CAN, route TXCAN and RXCAN as a 100 Ω differential pair matched to the bus impedance, with a TVS diode (e.g., PESD1CAN) within 10 mm of the connector. The high-current Port R outputs used for PWM motor drive should use 0.5 mm wide traces to handle the rated sink/source current without excessive voltage drop.
Enable the HCS12's internal pull-ups on unused I/O lines (configured via the PUCR register) to prevent floating CMOS inputs that couple noise into adjacent analog channels. For ADC inputs, the 10-bit successive-approximation converter holds the sample capacitor in the track-and-hold stage for a programmable acquisition time - too short a setting at high source impedance creates gain error. Drive the ADC inputs from low-impedance (< 10 kΩ) sources or use an external op-amp buffer. The PWM outputs can generate switching transients on adjacent traces; keep analog traces 3x trace-widths away from PWM output traces.
Compliance Information
RoHS compliant per NXP product page; industrial temperature grade (-40 °C to +85 °C) rather than AEC-Q100 automotive grade. For -40 °C to +125 °C automotive applications, choose the DP512MPVE or other Q-graded variants. Halogen-free status not explicitly stated in the retrieved web data - confirm via NXP environmental compliance letter before specifying.
