MC9S12DJ128MPVE vs MC9S12DB128MPVE Comparison

Detailed side-by-side comparison of MC9S12DJ128MPVE by NXP Semiconductors and MC9S12DB128MPVE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12DJ128MPVE MC9S12DJ128MPVE - 16-bit HCS12 MCU, 128KB Flash | NXP

MC9S12DJ128MPVE - 16-bit HCS12 MCU, 128KB Flash | NXP

MC9S12DJ128MPVE Nrnd
NXP Semiconductors
MC9S12DB128MPVE MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE ✓ Active

Specification Comparison

Parameter MC9S12DJ128MPVE MC9S12DB128MPVE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $19.25 $18.40
Core Architecture HCS12 (16-bit CISC) HCS12 (CPU12), 16-bit
Program Memory (Flash) 128 KB (128K x 8) —
RAM 8 KB —
EEPROM 2 KB —
Maximum CPU Clock 25 MHz (50 MHz internal bus via PLL, see datasheet) 25 MHz
Supply Voltage 2.35 V to 2.75 V (single 2.5V nominal) —
Digital I/O Pins 59 —
ADC 2x 8-channel, 10-bit —
PWM Channels 8 —
SCI (UART) 2 —
SPI 1 —
I2C (Inter-IC Bus) 1 —
Package 112-LQFP (20x20 mm) —
Operating Temperature -40C to +125C (automotive grade) —
Mounting Type Surface Mount Surface Mount (Gull Wing)
MSL Level [DATA_NEEDED: MSL level per JEDEC J-STD-020] —
Debug Interface BDM (Background Debug Mode) —
RoHS Status Compliant Compliant
Program Memory (FLASH) — 128 KB (128K x 8)
Data Memory (RAM) — 8 KB (8K x 8)
Number of I/O Pins — 91
Oscillator Type — Internal
Package / Case — 112-LQFP (20x20 mm)
Terminal Form — GULL WING
Number of Terminals — 112
Package Code — LQFP
Package Shape — SQUARE
Temperature Grade — AUTOMOTIVE
Packaging — Tray

Datasheets & Resources

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