MC9S12DJ128MPVE vs MC9S12DB128MPVE Comparación
Comparación detallada lado a lado de MC9S12DJ128MPVE por NXP Semiconductors y MC9S12DB128MPVE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP
MC9S12DB128MPVE ✓ ActivoComparación de especificaciones
| Parámetro | MC9S12DJ128MPVE | MC9S12DB128MPVE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $19,25 | $18,40 |
| Core Architecture | HCS12 (16-bit CISC) | HCS12 (CPU12), 16-bit |
| Program Memory (Flash) | 128 KB (128K x 8) | — |
| RAM | 8 KB | — |
| EEPROM | 2 KB | — |
| Maximum CPU Clock | 25 MHz (50 MHz internal bus via PLL, see datasheet) | 25 MHz |
| Tensión de alimentación | 2.35 V to 2.75 V (single 2.5V nominal) | — |
| Digital I/O Pins | 59 | — |
| ADC | 2x 8-channel, 10-bit | — |
| PWM Channels | 8 | — |
| SCI (UART) | 2 | — |
| SPI | 1 | — |
| I2C (Inter-IC Bus) | 1 | — |
| Encapsulado | 112-LQFP (20x20 mm) | — |
| Temperatura de funcionamiento | -40C to +125C (automotive grade) | — |
| Tipo de montaje | Surface Mount | Surface Mount (Gull Wing) |
| Nivel MSL | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Estado RoHS | Compliant | Compliant |
| Program Memory (FLASH) | — | 128 KB (128K x 8) |
| Data Memory (RAM) | — | 8 KB (8K x 8) |
| Number of I/O Pins | — | 91 |
| Oscillator Type | — | Internal |
| Encapsulado / Carcasa | — | 112-LQFP (20x20 mm) |
| Terminal Form | — | GULL WING |
| Number of Terminals | — | 112 |
| Package Code | — | LQFP |
| Package Shape | — | SQUARE |
| Temperature Grade | — | AUTOMOTIVE |
| Packaging | — | Tray |