MC9S12DJ128MPVE vs MC9S12DB128MPVE Vergleich
Detaillierter Direktvergleich von MC9S12DJ128MPVE von NXP Semiconductors und MC9S12DB128MPVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP
MC9S12DB128MPVE ✓ AktivSpezifikationsvergleich
| Parameter | MC9S12DJ128MPVE | MC9S12DB128MPVE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,25 | $18,40 |
| Core Architecture | HCS12 (16-bit CISC) | HCS12 (CPU12), 16-bit |
| Program Memory (Flash) | 128 KB (128K x 8) | — |
| RAM | 8 KB | — |
| EEPROM | 2 KB | — |
| Maximum CPU Clock | 25 MHz (50 MHz internal bus via PLL, see datasheet) | 25 MHz |
| Versorgungsspannung | 2.35 V to 2.75 V (single 2.5V nominal) | — |
| Digital I/O Pins | 59 | — |
| ADC | 2x 8-channel, 10-bit | — |
| PWM Channels | 8 | — |
| SCI (UART) | 2 | — |
| SPI | 1 | — |
| I2C (Inter-IC Bus) | 1 | — |
| Gehäuse | 112-LQFP (20x20 mm) | — |
| Betriebstemperatur | -40C to +125C (automotive grade) | — |
| Montageart | Surface Mount | Surface Mount (Gull Wing) |
| MSL-Level | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| RoHS-Status | Compliant | Compliant |
| Program Memory (FLASH) | — | 128 KB (128K x 8) |
| Data Memory (RAM) | — | 8 KB (8K x 8) |
| Number of I/O Pins | — | 91 |
| Oscillator Type | — | Internal |
| Gehäuse / Bauform | — | 112-LQFP (20x20 mm) |
| Terminal Form | — | GULL WING |
| Number of Terminals | — | 112 |
| Package Code | — | LQFP |
| Package Shape | — | SQUARE |
| Temperature Grade | — | AUTOMOTIVE |
| Packaging | — | Tray |