MC9S12DT256MFUE vs MC9S12B256MFUE Comparison
Detailed side-by-side comparison of MC9S12DT256MFUE by NXP Semiconductors and MC9S12B256MFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ ActiveSpecification Comparison
| Parameter | MC9S12DT256MFUE | MC9S12B256MFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $19.20 | $21.60 |
| Core Architecture | HCS12 (CPU12), 16-bit CISC | — |
| Maximum CPU Frequency | 25 MHz | — |
| Flash Memory | 256 KB (256K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 12 KB |
| EEPROM | [DATA_NEEDED: EEPROM size] | 4 KB |
| Data Bus Width | 16-bit | — |
| Operating Supply Voltage (Core) | 2.35 V to 2.75 V | — |
| I/O Supply Voltage | 5V-tolerant I/O on VDDR/VSSR | — |
| Number of I/O Pins | 91 | — |
| Package Type | 80-QFP (PQFP/LQFP-80, 14x14 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 80 | — |
| Temperature Grade | Automotive | — |
| MSL Level | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| On-chip CAN Module | MSCAN (CAN 2.0A/B) | — |
| ADC | 16-channel, 10-bit (per family) | 10-bit, 8-channel |
| PWM Module | 8-channel 16-bit PWM | 8-channel, 8-bit |
| Communication Peripherals | SCI, SPI, IIC, BDLC | — |
| Core | — | HCS12 (16-bit CISC) |
| CPU Family | — | S12B (MC9S12B series) |
| Maximum CPU Clock | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| Supply Voltage | — | 2.35 V to 5.5 V |
| CAN (msCAN) | — | 1 x CAN 2.0A/B |
| SCI / SPI / I2C | — | Yes (1 each) |
| Enhanced Capture Timer | — | 6 x 16-bit channels |
| Operating Temperature | — | -40 C to +125 C (junction) |
| Package | — | 80-QFP, 14 x 14 mm, 1.0 mm pitch |
| Debug Interface | — | BDM (Background Debug Mode) |
| Lifecycle | — | NRND (Not Recommended for New Designs) |