MC9S12DT256MFUE vs MC9S12B256MFUE Vergleich
Detaillierter Direktvergleich von MC9S12DT256MFUE von NXP Semiconductors und MC9S12B256MFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ AktivSpezifikationsvergleich
| Parameter | MC9S12DT256MFUE | MC9S12B256MFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,20 | $21,60 |
| Core Architecture | HCS12 (CPU12), 16-bit CISC | — |
| Maximum CPU Frequency | 25 MHz | — |
| Flash Memory | 256 KB (256K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 12 KB |
| EEPROM | [DATA_NEEDED: EEPROM size] | 4 KB |
| Datenbusbreite | 16-bit | — |
| Operating Supply Voltage (Core) | 2.35 V to 2.75 V | — |
| I/O Supply Voltage | 5V-tolerant I/O on VDDR/VSSR | — |
| Number of I/O Pins | 91 | — |
| Package Type | 80-QFP (PQFP/LQFP-80, 14x14 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 80 | — |
| Temperature Grade | Automotive | — |
| MSL-Level | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| On-chip CAN Module | MSCAN (CAN 2.0A/B) | — |
| ADC | 16-channel, 10-bit (per family) | 10-bit, 8-channel |
| PWM Module | 8-channel 16-bit PWM | 8-channel, 8-bit |
| Communication Peripherals | SCI, SPI, IIC, BDLC | — |
| Core | — | HCS12 (16-bit CISC) |
| CPU Family | — | S12B (MC9S12B series) |
| Maximum CPU Clock | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| Versorgungsspannung | — | 2.35 V to 5.5 V |
| CAN (msCAN) | — | 1 x CAN 2.0A/B |
| SCI / SPI / I2C | — | Yes (1 each) |
| Enhanced Capture Timer | — | 6 x 16-bit channels |
| Betriebstemperatur | — | -40 C to +125 C (junction) |
| Gehäuse | — | 80-QFP, 14 x 14 mm, 1.0 mm pitch |
| Debug Interface | — | BDM (Background Debug Mode) |
| Lifecycle | — | NRND (Not Recommended for New Designs) |