MC9S12DT256MFUE vs MC9S12B256MFUE Comparação

Comparação detalhada lado a lado de MC9S12DT256MFUE por NXP Semiconductors e MC9S12B256MFUE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12DT256MFUE MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE ✓ Ativo
NXP Semiconductors
MC9S12B256MFUE MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP

MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP

MC9S12B256MFUE Nrnd

Comparação de especificações

Parâmetro MC9S12DT256MFUE MC9S12B256MFUE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $19,20 $21,60
Core Architecture HCS12 (CPU12), 16-bit CISC —
Maximum CPU Frequency 25 MHz —
Flash Memory 256 KB (256K x 8) —
RAM [DATA_NEEDED: RAM size] 12 KB
EEPROM [DATA_NEEDED: EEPROM size] 4 KB
Largura do barramento de dados 16-bit —
Operating Supply Voltage (Core) 2.35 V to 2.75 V —
I/O Supply Voltage 5V-tolerant I/O on VDDR/VSSR —
Number of I/O Pins 91 —
Package Type 80-QFP (PQFP/LQFP-80, 14x14 mm) —
Tipo de montagem Surface Mount Surface Mount
Terminal Form GULL WING —
Number of Terminals 80 —
Temperature Grade Automotive —
Nível MSL [DATA_NEEDED: MSL level] 3 (168 hours)
Status RoHS [DATA_NEEDED: RoHS status] Compliant
On-chip CAN Module MSCAN (CAN 2.0A/B) —
ADC 16-channel, 10-bit (per family) 10-bit, 8-channel
PWM Module 8-channel 16-bit PWM 8-channel, 8-bit
Communication Peripherals SCI, SPI, IIC, BDLC —
Core — HCS12 (16-bit CISC)
CPU Family — S12B (MC9S12B series)
Maximum CPU Clock — 25 MHz
Program Memory (Flash) — 256 KB (256K x 8)
Tensão de alimentação — 2.35 V to 5.5 V
CAN (msCAN) — 1 x CAN 2.0A/B
SCI / SPI / I2C — Yes (1 each)
Enhanced Capture Timer — 6 x 16-bit channels
Temperatura de operação — -40 C to +125 C (junction)
Encapsulamento — 80-QFP, 14 x 14 mm, 1.0 mm pitch
Debug Interface — BDM (Background Debug Mode)
Lifecycle — NRND (Not Recommended for New Designs)

Fichas técnicas e recursos

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