MC9S12DT256MPVE vs MC9S12D64CPVE Comparison

Detailed side-by-side comparison of MC9S12DT256MPVE by NXP Semiconductors and MC9S12D64CPVE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd

Specification Comparison

Parameter MC9S12DT256MPVE MC9S12D64CPVE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $14.36 $11.50
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz 25 MHz
Program Memory (Flash) 256 KB —
RAM 12 KB —
EEPROM 4 KB —
Data Bus Width 16-bit —
Supply Voltage 2.35 V to 2.75 V (regulated core) 2.5 V / 5 V
I/O Pins 91 —
ADC 2 x 10-bit, 8 channels each (16 channels total) 8-channel, 10-bit (x2 ATD modules)
Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
Package 112-LQFP (20x20 mm) 112-LQFP (20x20 mm)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40C to +125C (automotive grade) -40C to +85C (industrial)
Debug Interface Background Debug Mode (BDM) + JTAG —
RoHS Status Compliant —
Lifecycle Status NRND (Not Recommended for New Designs) —
Core Processor — HCS12
Core Size — 16-Bit
Architecture — CISC
Program Memory Size — 64 KB (64K x 8) Flash
RAM Size — 4 KB (4K x 8)
EEPROM Size — 1 KB (1K x 8)
Number of I/O — 91
Connectivity — CANbus, I2C, SCI, SPI
Peripherals — PWM, WDT, ECT, ATD
PWM Channels — 8
AEC-Q100 — Qualified (automotive)
Lead-Free / RoHS — Compliant per NXP product page

Datasheets & Resources

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