MC9S12DT256MPVE vs MC9S12DG256MFUE Comparison

Detailed side-by-side comparison of MC9S12DT256MPVE by NXP Semiconductors and MC9S12DG256MFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd
NXP Semiconductors
MC9S12DG256MFUE MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP

MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP

MC9S12DG256MFUE Nrnd

Specification Comparison

Parameter MC9S12DT256MPVE MC9S12DG256MFUE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $14.36 $14.95
Core HCS12 (16-bit CISC) HCS12 (16-bit CISC)
Maximum CPU Frequency 25 MHz 25 MHz
Program Memory (Flash) 256 KB —
RAM 12 KB 12 KB
EEPROM 4 KB 4 KB
Data Bus Width 16-bit —
Supply Voltage 2.35 V to 2.75 V (regulated core) 2.35 V to 2.75 V (5 V core) [DATA_NEEDED: full operating range incl. I/O]
I/O Pins 91 59
ADC 2 x 10-bit, 8 channels each (16 channels total) 8-channel, 10-bit
Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
Package 112-LQFP (20x20 mm) 80-LQFP (QFP-80), 14x14 mm
Mounting Type Surface Mount Surface Mount
Operating Temperature -40C to +125C (automotive grade) -40C to +125C (AEC-Q100)
Debug Interface Background Debug Mode (BDM) + JTAG —
RoHS Status Compliant Compliant
Lifecycle Status NRND (Not Recommended for New Designs) —
Program Memory — 256 KB Flash
Timer — 8-channel Enhanced Capture Timer
Communication — 2x SCI, 2x SPI, I2C, CAN 2.0
AEC-Q100 Grade — Qualified

Datasheets & Resources

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