MC9S12DT256MPVE vs MC9S12DG256MFUE 对比

详细并排对比 MC9S12DT256MPVE 出自 NXP Semiconductors 和 MC9S12DG256MFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd
NXP Semiconductors
MC9S12DG256MFUE MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP

MC9S12DG256MFUE - 16-bit HCS12 MCU, 256KB Flash, 80-QFP | NXP

MC9S12DG256MFUE Nrnd

规格对比

参数 MC9S12DT256MPVE MC9S12DG256MFUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $14.36 $14.95
Core HCS12 (16-bit CISC) HCS12 (16-bit CISC)
Maximum CPU Frequency 25 MHz 25 MHz
Program Memory (Flash) 256 KB —
RAM 12 KB 12 KB
EEPROM 4 KB 4 KB
数据总线宽度 16-bit —
电源电压 2.35 V to 2.75 V (regulated core) 2.35 V to 2.75 V (5 V core) [DATA_NEEDED: full operating range incl. I/O]
I/O Pins 91 59
ADC 2 x 10-bit, 8 channels each (16 channels total) 8-channel, 10-bit
Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
封装 112-LQFP (20x20 mm) 80-LQFP (QFP-80), 14x14 mm
安装类型 Surface Mount Surface Mount
工作温度 -40C to +125C (automotive grade) -40C to +125C (AEC-Q100)
Debug Interface Background Debug Mode (BDM) + JTAG —
RoHS 状态 Compliant Compliant
生命周期状态 NRND (Not Recommended for New Designs) —
Program Memory — 256 KB Flash
Timer — 8-channel Enhanced Capture Timer
Communication — 2x SCI, 2x SPI, I2C, CAN 2.0
AEC-Q100 Grade — Qualified

数据手册与资源

浏览全部产品 创建 BOM 获取报价