MC9S12GC32MFAE vs MC9S12C32MPBE16 Comparison
Detailed side-by-side comparison of MC9S12GC32MFAE by NXP Semiconductors and MC9S12C32MPBE16 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12C32MPBE16 - 16-Bit HCS12 MCU, 32KB Flash, 52-LQFP | NXP
MC9S12C32MPBE16 ✓ ActiveSpecification Comparison
| Parameter | MC9S12GC32MFAE | MC9S12C32MPBE16 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8.44 | $4.93 |
| Core | HCS12 (16-bit) | — |
| CPU Family | S12GC | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 2 KB | — |
| EEPROM | 1 KB | — |
| Maximum Bus Clock | 25 MHz (50 MHz core via PLL) | — |
| Supply Voltage | 2.97 V to 5.5 V | 2.5 V / 5 V |
| Internal Voltage Regulator | On-chip bandgap Vreg (2.5 V core) | — |
| ADC | 10-bit | — |
| PWM / Timer Channels | 8 channels | — |
| SCI (UART) | Up to 2 | — |
| SPI | 1 | — |
| GPIO | Up to 60 | — |
| Debug Interface | BDM (single-wire background debug) | BDM (Background Debug Mode) |
| Package | 48-LQFP (7x7 mm) | — |
| Operating Temperature | [DATA_NEEDED: operating temperature grade] | [DATA_NEEDED: operating temperature range] |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Mounting Type | Surface Mount | Surface Mount |
| Core Architecture | — | HCS12 (CPU12) |
| Data Bus Width | — | 16-bit |
| Program Memory Size | — | 32 KB (32K x 8) Flash |
| RAM Size | — | 2 KB (2K x 8) |
| Maximum CPU Frequency | — | 16 MHz |
| Number of I/O Pins | — | 35 |
| Package / Case | — | 52-LQFP (10x10 mm) |
| Oscillator Type | — | Internal |
| Packaging | — | Tray |
| Peripherals | — | MSCAN (CAN 2.0A/B), SCI, SPI, 16-bit Timer, 10-bit ADC |
| Lead-Free | — | Yes |