MC9S12GC32MFAE vs MC9S12C32MPBE16 Vergleich
Detaillierter Direktvergleich von MC9S12GC32MFAE von NXP Semiconductors und MC9S12C32MPBE16 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12C32MPBE16 - 16-Bit HCS12 MCU, 32KB Flash, 52-LQFP | NXP
MC9S12C32MPBE16 ✓ AktivSpezifikationsvergleich
| Parameter | MC9S12GC32MFAE | MC9S12C32MPBE16 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,44 | $4,93 |
| Core | HCS12 (16-bit) | — |
| CPU Family | S12GC | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 2 KB | — |
| EEPROM | 1 KB | — |
| Maximum Bus Clock | 25 MHz (50 MHz core via PLL) | — |
| Versorgungsspannung | 2.97 V to 5.5 V | 2.5 V / 5 V |
| Internal Voltage Regulator | On-chip bandgap Vreg (2.5 V core) | — |
| ADC | 10-bit | — |
| PWM / Timer Channels | 8 channels | — |
| SCI (UART) | Up to 2 | — |
| SPI | 1 | — |
| GPIO | Up to 60 | — |
| Debug Interface | BDM (single-wire background debug) | BDM (Background Debug Mode) |
| Gehäuse | 48-LQFP (7x7 mm) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature grade] | [DATA_NEEDED: operating temperature range] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Montageart | Surface Mount | Surface Mount |
| Core Architecture | — | HCS12 (CPU12) |
| Datenbusbreite | — | 16-bit |
| Program Memory Size | — | 32 KB (32K x 8) Flash |
| RAM Size | — | 2 KB (2K x 8) |
| Maximum CPU Frequency | — | 16 MHz |
| Number of I/O Pins | — | 35 |
| Gehäuse / Bauform | — | 52-LQFP (10x10 mm) |
| Oscillator Type | — | Internal |
| Packaging | — | Tray |
| Peripherals | — | MSCAN (CAN 2.0A/B), SCI, SPI, 16-bit Timer, 10-bit ADC |
| Lead-Free | — | Yes |