MC9S12GC32MFAE vs MC9S12C32MPBE16 对比
详细并排对比 MC9S12GC32MFAE 出自 NXP Semiconductors 和 MC9S12C32MPBE16 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S12C32MPBE16 - 16-Bit HCS12 MCU, 32KB Flash, 52-LQFP | NXP
MC9S12C32MPBE16 ✓ 量产中规格对比
| 参数 | MC9S12GC32MFAE | MC9S12C32MPBE16 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $8.44 | $4.93 |
| Core | HCS12 (16-bit) | — |
| CPU Family | S12GC | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 2 KB | — |
| EEPROM | 1 KB | — |
| Maximum Bus Clock | 25 MHz (50 MHz core via PLL) | — |
| 电源电压 | 2.97 V to 5.5 V | 2.5 V / 5 V |
| Internal Voltage Regulator | On-chip bandgap Vreg (2.5 V core) | — |
| ADC | 10-bit | — |
| PWM / Timer Channels | 8 channels | — |
| SCI (UART) | Up to 2 | — |
| SPI | 1 | — |
| GPIO | Up to 60 | — |
| Debug Interface | BDM (single-wire background debug) | BDM (Background Debug Mode) |
| 封装 | 48-LQFP (7x7 mm) | — |
| 工作温度 | [DATA_NEEDED: operating temperature grade] | [DATA_NEEDED: operating temperature range] |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| 安装类型 | Surface Mount | Surface Mount |
| Core Architecture | — | HCS12 (CPU12) |
| 数据总线宽度 | — | 16-bit |
| Program Memory Size | — | 32 KB (32K x 8) Flash |
| RAM Size | — | 2 KB (2K x 8) |
| Maximum CPU Frequency | — | 16 MHz |
| Number of I/O Pins | — | 35 |
| 封装 / 外壳 | — | 52-LQFP (10x10 mm) |
| Oscillator Type | — | Internal |
| Packaging | — | Tray |
| Peripherals | — | MSCAN (CAN 2.0A/B), SCI, SPI, 16-bit Timer, 10-bit ADC |
| Lead-Free | — | Yes |