MC9S12H256VFVE vs MC9S12P128MQK Comparison

Detailed side-by-side comparison of MC9S12H256VFVE by NXP Semiconductors and MC9S12P128MQK by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12P128MQK MC9S12P128MQK - 16-Bit 128KB Flash S12 MCU | NXP | QFP-80

MC9S12P128MQK - 16-Bit 128KB Flash S12 MCU | NXP | QFP-80

MC9S12P128MQK ✓ Active

Specification Comparison

Parameter MC9S12H256VFVE MC9S12P128MQK
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Obsolete Active
Stock Status In Stock In Stock
Unit Price (USD) $10.95 $6.10
Core Processor HCS12 CPU12 —
Core Size 16-Bit —
Core Architecture CISC HCS12 / CPU12 (16-bit)
Maximum Clock Frequency 16 MHz —
Program Memory Size 256 KB (256K x 8) FLASH —
Data RAM 12 KB 6 KB
EEPROM 4 KB —
Number of I/O Pins 99 —
Supply Voltage 2.5 V core / 5 V I/O 3.15 V to 5.5 V
Operating Temperature -40 C to +105 C (automotive) -40 °C to +125 °C (Automotive)
Package 144-LQFP (20 x 20 mm) QFP-80 (LQFP-80, 14x14 mm)
Mounting Type Surface Mount —
Connectivity CANbus (2x), I2C, SCI, SPI —
Peripherals LCD driver, POR, PWM, WDT —
Automotive Qualification AEC-Q100 —
MSL Level 3 (168 hours) —
Program Memory — 128 KB Flash
Maximum CPU Frequency — 32 MHz
Data Bus Width — 16-bit
Number of I/Os — 64 I/O
ADC Resolution — 12-bit
Mounting Style — SMD/SMT
Terminal Form — GULL WING
Communications — CAN, SCI, SPI
Programming Interface — Background Debug Mode (BDM)
Temperature Grade — Automotive
RoHS Status — [DATA_NEEDED: RoHS status]

Datasheets & Resources

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