MC9S12XDT256CPV vs MC9S12DG256CCPV Comparison
Detailed side-by-side comparison of MC9S12XDT256CPV by NXP Semiconductors and MC9S12DG256CCPV by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
MC9S12XDT256CPV NrndNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndSpecification Comparison
| Parameter | MC9S12XDT256CPV | MC9S12DG256CCPV |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $12.25 | $18.20 |
| Core | HCS12X (16-bit CISC with XGATE co-processor) | HCS12 (16-bit CISC) |
| Family | S12XD | — |
| Program Memory | 256 KB Flash | — |
| EEPROM | 4 KB | — |
| RAM | 12 KB | — |
| CPU Bus Frequency | 25 MHz / 40 MHz (max) | — |
| XGATE Co-processor | 80 MHz, RISC-style peripheral engine | — |
| Supply Voltage | 2.5 V / 5 V (dual-range) | — |
| Package | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | — |
| Pin Count | 112 | — |
| Temperature Grade | Industrial (-40C to +85C) | — |
| Mounting Type | Surface Mount | Surface Mount |
| CAN Modules | Up to 2 x CAN 2.0A/B (msCAN) | — |
| SCI / SPI / I2C | 2 x SCI, 2 x SPI, 1 x I2C | — |
| ADC | 8-channel, 10-bit ATD | 8-channel, 10-bit |
| PWM Channels | 4 x 8/16-bit PWM | 8 channels |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI | Enhanced Capture Timer (ECT) + watchdog |
| Debug Interface | BDM (Background Debug Mode) | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Operating Temperature Range | — | -40 °C to +85 °C (industrial) |
| Package / Case | — | 112-LQFP (20 x 20 mm) |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| MSL Level | — | 3 (168 hours, JEDEC J-STD-020) |