MC9S12XDT256CPV vs MC9S12DG256CCPV 对比
详细并排对比 MC9S12XDT256CPV 出自 NXP Semiconductors 和 MC9S12DG256CCPV 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
MC9S12XDT256CPV NrndNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV Nrnd规格对比
| 参数 | MC9S12XDT256CPV | MC9S12DG256CCPV |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $12.25 | $18.20 |
| Core | HCS12X (16-bit CISC with XGATE co-processor) | HCS12 (16-bit CISC) |
| Family | S12XD | — |
| Program Memory | 256 KB Flash | — |
| EEPROM | 4 KB | — |
| RAM | 12 KB | — |
| CPU Bus Frequency | 25 MHz / 40 MHz (max) | — |
| XGATE Co-processor | 80 MHz, RISC-style peripheral engine | — |
| 电源电压 | 2.5 V / 5 V (dual-range) | — |
| 封装 | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | — |
| 引脚数量 | 112 | — |
| Temperature Grade | Industrial (-40C to +85C) | — |
| 安装类型 | Surface Mount | Surface Mount |
| CAN Modules | Up to 2 x CAN 2.0A/B (msCAN) | — |
| SCI / SPI / I2C | 2 x SCI, 2 x SPI, 1 x I2C | — |
| ADC | 8-channel, 10-bit ATD | 8-channel, 10-bit |
| PWM Channels | 4 x 8/16-bit PWM | 8 channels |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI | Enhanced Capture Timer (ECT) + watchdog |
| Debug Interface | BDM (Background Debug Mode) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| 工作温度范围 | — | -40 °C to +85 °C (industrial) |
| 封装 / 外壳 | — | 112-LQFP (20 x 20 mm) |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| MSL 等级 | — | 3 (168 hours, JEDEC J-STD-020) |