MC9S12XDT256CPV vs MC9S12DG256CCPV 비교

다음의 상세 나란히 비교: MC9S12XDT256CPV 제조: NXP Semiconductors 및 MC9S12DG256CCPV 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12DG256CCPV MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV Nrnd

사양 비교

파라미터 MC9S12XDT256CPV MC9S12DG256CCPV
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $12.25 $18.20
Core HCS12X (16-bit CISC with XGATE co-processor) HCS12 (16-bit CISC)
Family S12XD —
Program Memory 256 KB Flash —
EEPROM 4 KB —
RAM 12 KB —
CPU Bus Frequency 25 MHz / 40 MHz (max) —
XGATE Co-processor 80 MHz, RISC-style peripheral engine —
공급 전압 2.5 V / 5 V (dual-range) —
패키지 112-LQFP (20 x 20 mm, 0.65 mm pitch) —
핀 수 112 —
Temperature Grade Industrial (-40C to +85C) —
실장 유형 Surface Mount Surface Mount
CAN Modules Up to 2 x CAN 2.0A/B (msCAN) —
SCI / SPI / I2C 2 x SCI, 2 x SPI, 1 x I2C —
ADC 8-channel, 10-bit ATD 8-channel, 10-bit
PWM Channels 4 x 8/16-bit PWM 8 channels
Timers ECT (Enhanced Capture Timer), PIT, RTI Enhanced Capture Timer (ECT) + watchdog
Debug Interface BDM (Background Debug Mode) —
RoHS 상태 [DATA_NEEDED: RoHS compliance status] Compliant
Maximum CPU/Bus Frequency — 25 MHz
Program Memory (Flash) — 256 KB (256K x 8)
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Lines — 91
Supply Voltage Range — 2.97 V to 5.5 V (single 5 V supply)
동작 온도 범위 — -40 °C to +85 °C (industrial)
패키지 / 케이스 — 112-LQFP (20 x 20 mm)
Communication Interfaces — 2 x SCI, 2 x SPI, I2C, CAN 2.0
On-chip Debug — Background Debug Mode (BDM)
MSL 레벨 — 3 (168 hours, JEDEC J-STD-020)

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