MP3V5010GVP vs MPVZ5010G7U Comparison
Detailed side-by-side comparison of MP3V5010GVP by NXP Semiconductors and MPVZ5010G7U by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPVZ5010G7U - 10 kPa Vented Gauge Pressure Sensor, 8-DIP | NXP
MPVZ5010G7U ✓ ActiveSpecification Comparison
| Parameter | MP3V5010GVP | MPVZ5010G7U |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Pressure Sensors | Pressure Sensors |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.85 | $7.25 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Pressure Range | 0 kPa to 10 kPa (0 to 1.45 PSI) | — |
| Output Type | Analog Voltage (ratiometric) | Analog, ratiometric to Vcc |
| Output Voltage Range | 0.1 V to 3.1 V | — |
| Supply Voltage | 2.7 V to 3.3 V (3 V nominal) | — |
| Sensitivity | 0.2 V/kPa nominal | — |
| Accuracy | 5% (0 to 85 C) | ±1.5 %FS (0 °C to 85 °C) |
| Operating Temperature | -40 C to +125 C | — |
| Storage Temperature | -40 C to +125 C | — |
| Port Configuration | Vertical bottom-port male tube, 0.13" (3.17 mm) | — |
| Package | SOP-8 (Case 1368-01), 8-SMD Module | 8-DIP Module (Case 1368-01, through-hole) |
| Mounting Type | Surface Mount | Through-Hole (DIP module with vent tube) |
| Automotive Qualification | AEC-Q100 | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Supply Voltage (Vcc) | — | 4.75 V to 5.25 V (5 V typical) |
| Supply Current | — | 10 mA (maximum) |
| Analog Output Range | — | 0.2 V to 4.7 V |
| Response Time | — | [DATA_NEEDED: response time ms] |
| Operating Temperature Range | — | 0 °C to +85 °C |
| Compensated Temperature Range | — | -10 °C to +60 °C |
| Storage Temperature Range | — | -30 °C to +100 °C [DATA_NEEDED: confirm exact storage spec] |
| Sensor Technology | — | Piezoresistive silicon micromachined |
| Signal Conditioning | — | On-chip, temperature compensated, calibrated |
| MSL Level | — | [DATA_NEEDED: MSL rating] |
| Body Height | — | 5.46 mm |