MP3V5010GVP vs MPVZ5010G7U Vergleich
Detaillierter Direktvergleich von MP3V5010GVP von NXP Semiconductors und MPVZ5010G7U von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPVZ5010G7U - 10 kPa Vented Gauge Pressure Sensor, 8-DIP | NXP
MPVZ5010G7U ✓ AktivSpezifikationsvergleich
| Parameter | MP3V5010GVP | MPVZ5010G7U |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,85 | $7,25 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Pressure Range | 0 kPa to 10 kPa (0 to 1.45 PSI) | — |
| Ausgangstyp | Analog Voltage (ratiometric) | Analog, ratiometric to Vcc |
| Ausgangsspannungsbereich | 0.1 V to 3.1 V | — |
| Versorgungsspannung | 2.7 V to 3.3 V (3 V nominal) | — |
| Sensitivity | 0.2 V/kPa nominal | — |
| Accuracy | 5% (0 to 85 C) | ±1.5 %FS (0 °C to 85 °C) |
| Betriebstemperatur | -40 C to +125 C | — |
| Storage Temperature | -40 C to +125 C | — |
| Port Configuration | Vertical bottom-port male tube, 0.13" (3.17 mm) | — |
| Gehäuse | SOP-8 (Case 1368-01), 8-SMD Module | 8-DIP Module (Case 1368-01, through-hole) |
| Montageart | Surface Mount | Through-Hole (DIP module with vent tube) |
| Automotive Qualification | AEC-Q100 | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Supply Voltage (Vcc) | — | 4.75 V to 5.25 V (5 V typical) |
| Versorgungsstrom | — | 10 mA (maximum) |
| Analog Output Range | — | 0.2 V to 4.7 V |
| Response Time | — | [DATA_NEEDED: response time ms] |
| Betriebstemperaturbereich | — | 0 °C to +85 °C |
| Compensated Temperature Range | — | -10 °C to +60 °C |
| Storage Temperature Range | — | -30 °C to +100 °C [DATA_NEEDED: confirm exact storage spec] |
| Sensor Technology | — | Piezoresistive silicon micromachined |
| Signal Conditioning | — | On-chip, temperature compensated, calibrated |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Body Height | — | 5.46 mm |