MPC5554MVR132 vs MPC5554MVR80 Comparison

Detailed side-by-side comparison of MPC5554MVR132 by NXP Semiconductors and MPC5554MVR80 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd

Specification Comparison

Parameter MPC5554MVR132 MPC5554MVR80
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $27.25 $43.00
Core Architecture Power Architecture e200z6 —
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
Package 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch
Mounting Type Surface Mount Surface Mount
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
Operating Temperature Range -40 C to +125 C (junction) —
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
RoHS Status Compliant Lead-Free (MS-034AAL-1 TEPBGA-416)
MSL Level 3 (per JEDEC J-STD-020) —
Core — e200z6 (Power Architecture)
CPU Architecture — 32-bit RISC, 7-stage pipeline
Maximum CPU Frequency — 80 MHz
Program Flash Memory — 2 MB (2M x 8)
Operating Temperature — -40C to +125C (Automotive Grade)
Supply Voltage — 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet)
Series — MPC55xx Qorivva
RAM Size — [DATA_NEEDED: RAM size]
Data Converters — [DATA_NEEDED: ADC/DAC channels]
Number of I/O — [DATA_NEEDED: I/O count]
Connectivity — CAN, FlexRay, eMIOS, eTPU
Lifecycle Stage — NRND (Not Recommended for New Designs)

Datasheets & Resources

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