MPC5554MVR132 vs MPC5554MVR80 비교

다음의 상세 나란히 비교: MPC5554MVR132 제조: NXP Semiconductors 및 MPC5554MVR80 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd

사양 비교

파라미터 MPC5554MVR132 MPC5554MVR80
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $27.25 $43.00
Core Architecture Power Architecture e200z6 —
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
패키지 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch
실장 유형 Surface Mount Surface Mount
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
동작 온도 범위 -40 C to +125 C (junction) —
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
RoHS 상태 Compliant Lead-Free (MS-034AAL-1 TEPBGA-416)
MSL 레벨 3 (per JEDEC J-STD-020) —
Core — e200z6 (Power Architecture)
CPU Architecture — 32-bit RISC, 7-stage pipeline
Maximum CPU Frequency — 80 MHz
Program Flash Memory — 2 MB (2M x 8)
동작 온도 — -40C to +125C (Automotive Grade)
공급 전압 — 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet)
Series — MPC55xx Qorivva
RAM Size — [DATA_NEEDED: RAM size]
Data Converters — [DATA_NEEDED: ADC/DAC channels]
Number of I/O — [DATA_NEEDED: I/O count]
Connectivity — CAN, FlexRay, eMIOS, eTPU
Lifecycle Stage — NRND (Not Recommended for New Designs)

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