MPC5554MVR132 vs MPC5554MVR80 Vergleich

Detaillierter Direktvergleich von MPC5554MVR132 von NXP Semiconductors und MPC5554MVR80 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd

Spezifikationsvergleich

Parameter MPC5554MVR132 MPC5554MVR80
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $27,25 $43,00
Core Architecture Power Architecture e200z6 —
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
Gehäuse 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch
Montageart Surface Mount Surface Mount
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
Betriebstemperaturbereich -40 C to +125 C (junction) —
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
RoHS-Status Compliant Lead-Free (MS-034AAL-1 TEPBGA-416)
MSL-Level 3 (per JEDEC J-STD-020) —
Core — e200z6 (Power Architecture)
CPU Architecture — 32-bit RISC, 7-stage pipeline
Maximum CPU Frequency — 80 MHz
Program Flash Memory — 2 MB (2M x 8)
Betriebstemperatur — -40C to +125C (Automotive Grade)
Versorgungsspannung — 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet)
Series — MPC55xx Qorivva
RAM Size — [DATA_NEEDED: RAM size]
Data Converters — [DATA_NEEDED: ADC/DAC channels]
Number of I/O — [DATA_NEEDED: I/O count]
Connectivity — CAN, FlexRay, eMIOS, eTPU
Lifecycle Stage — NRND (Not Recommended for New Designs)

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern