MPC5554MVR132 vs MPC5554MVR80 对比

详细并排对比 MPC5554MVR132 出自 NXP Semiconductors 和 MPC5554MVR80 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd

规格对比

参数 MPC5554MVR132 MPC5554MVR80
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $27.25 $43.00
Core Architecture Power Architecture e200z6 —
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
封装 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch
安装类型 Surface Mount Surface Mount
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
工作温度范围 -40 C to +125 C (junction) —
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
RoHS 状态 Compliant Lead-Free (MS-034AAL-1 TEPBGA-416)
MSL 等级 3 (per JEDEC J-STD-020) —
Core — e200z6 (Power Architecture)
CPU Architecture — 32-bit RISC, 7-stage pipeline
Maximum CPU Frequency — 80 MHz
Program Flash Memory — 2 MB (2M x 8)
工作温度 — -40C to +125C (Automotive Grade)
电源电压 — 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet)
Series — MPC55xx Qorivva
RAM Size — [DATA_NEEDED: RAM size]
Data Converters — [DATA_NEEDED: ADC/DAC channels]
Number of I/O — [DATA_NEEDED: I/O count]
Connectivity — CAN, FlexRay, eMIOS, eTPU
Lifecycle Stage — NRND (Not Recommended for New Designs)

数据手册与资源

浏览全部产品 创建 BOM 获取报价