MPC5554MVR80 vs MPC5554AZP132 Comparison

Detailed side-by-side comparison of MPC5554MVR80 by NXP Semiconductors and MPC5554AZP132 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter MPC5554MVR80 MPC5554AZP132
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $43.00 $228.00
Core e200z6 (Power Architecture) —
CPU Architecture 32-bit RISC, 7-stage pipeline —
Maximum CPU Frequency 80 MHz —
Program Flash Memory 2 MB (2M x 8) —
Package 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch 416-PBGA (TEPBGA-416), 27 x 27 mm
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature -40C to +125C (Automotive Grade) —
Supply Voltage 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet) [DATA_NEEDED: supply voltage range]
Series MPC55xx Qorivva —
RAM Size [DATA_NEEDED: RAM size] [DATA_NEEDED: on-chip SRAM size]
Data Converters [DATA_NEEDED: ADC/DAC channels] —
Number of I/O [DATA_NEEDED: I/O count] —
Connectivity CAN, FlexRay, eMIOS, eTPU —
RoHS Status Lead-Free (MS-034AAL-1 TEPBGA-416) Compliant (lead-free PBGA)
Lifecycle Stage NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
Core Architecture — Power Architecture e200z6
Core Bit Width — 32-bit
Maximum Core Frequency — 132 MHz
Program Memory (Flash) — 2 MB (2M x 8)
Ball Pitch — 1.0 mm
Lead-Free Status — Lead free (per package marking MS-034AAL-1)
Product Family — Qorivva MPC55xx
Peripheral Integration — FlexCAN, eMIOS, eQADC, DSPI (per datasheet reference manual)
Instruction Set — Power Architecture with VLE extension
Operating Temperature Range — [DATA_NEEDED: operating temperature range]

Datasheets & Resources

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