MPC5554MVR80 vs MPC5554AZP132 Comparação
Comparação detalhada lado a lado de MPC5554MVR80 por NXP Semiconductors e MPC5554AZP132 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC5554AZP132 - 32-Bit 132MHz Power MCU, 2MB Flash, 416-PBGA | NXP
MPC5554AZP132 NrndComparação de especificações
| Parâmetro | MPC5554MVR80 | MPC5554AZP132 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $43,00 | $228,00 |
| Core | e200z6 (Power Architecture) | — |
| CPU Architecture | 32-bit RISC, 7-stage pipeline | — |
| Maximum CPU Frequency | 80 MHz | — |
| Program Flash Memory | 2 MB (2M x 8) | — |
| Encapsulamento | 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch | 416-PBGA (TEPBGA-416), 27 x 27 mm |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Temperatura de operação | -40C to +125C (Automotive Grade) | — |
| Tensão de alimentação | 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet) | [DATA_NEEDED: supply voltage range] |
| Series | MPC55xx Qorivva | — |
| RAM Size | [DATA_NEEDED: RAM size] | [DATA_NEEDED: on-chip SRAM size] |
| Data Converters | [DATA_NEEDED: ADC/DAC channels] | — |
| Number of I/O | [DATA_NEEDED: I/O count] | — |
| Connectivity | CAN, FlexRay, eMIOS, eTPU | — |
| Status RoHS | Lead-Free (MS-034AAL-1 TEPBGA-416) | Compliant (lead-free PBGA) |
| Lifecycle Stage | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) |
| Core Architecture | — | Power Architecture e200z6 |
| Core Bit Width | — | 32-bit |
| Maximum Core Frequency | — | 132 MHz |
| Program Memory (Flash) | — | 2 MB (2M x 8) |
| Ball Pitch | — | 1.0 mm |
| Lead-Free Status | — | Lead free (per package marking MS-034AAL-1) |
| Product Family | — | Qorivva MPC55xx |
| Peripheral Integration | — | FlexCAN, eMIOS, eQADC, DSPI (per datasheet reference manual) |
| Instruction Set | — | Power Architecture with VLE extension |
| Faixa de temperatura de operação | — | [DATA_NEEDED: operating temperature range] |