MPC5554MVR80 vs MPC5554AZP132 Vergleich

Detaillierter Direktvergleich von MPC5554MVR80 von NXP Semiconductors und MPC5554AZP132 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter MPC5554MVR80 MPC5554AZP132
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $43,00 $228,00
Core e200z6 (Power Architecture) —
CPU Architecture 32-bit RISC, 7-stage pipeline —
Maximum CPU Frequency 80 MHz —
Program Flash Memory 2 MB (2M x 8) —
Gehäuse 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch 416-PBGA (TEPBGA-416), 27 x 27 mm
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur -40C to +125C (Automotive Grade) —
Versorgungsspannung 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet) [DATA_NEEDED: supply voltage range]
Series MPC55xx Qorivva —
RAM Size [DATA_NEEDED: RAM size] [DATA_NEEDED: on-chip SRAM size]
Data Converters [DATA_NEEDED: ADC/DAC channels] —
Number of I/O [DATA_NEEDED: I/O count] —
Connectivity CAN, FlexRay, eMIOS, eTPU —
RoHS-Status Lead-Free (MS-034AAL-1 TEPBGA-416) Compliant (lead-free PBGA)
Lifecycle Stage NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
Core Architecture — Power Architecture e200z6
Core Bit Width — 32-bit
Maximum Core Frequency — 132 MHz
Program Memory (Flash) — 2 MB (2M x 8)
Ball Pitch — 1.0 mm
Lead-Free Status — Lead free (per package marking MS-034AAL-1)
Product Family — Qorivva MPC55xx
Peripheral Integration — FlexCAN, eMIOS, eQADC, DSPI (per datasheet reference manual)
Instruction Set — Power Architecture with VLE extension
Betriebstemperaturbereich — [DATA_NEEDED: operating temperature range]

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