MPC7410HX500LE vs MPC7410RX500LE Comparison
Detailed side-by-side comparison of MPC7410HX500LE by NXP Semiconductors and MPC7410RX500LE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC7410HX500LE | MPC7410RX500LE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MPC7410HX500LE | — |
| Processor Family | PowerPC G4 (MPC74xx) | — |
| Core Architecture | Power Architecture with AltiVec SIMD | PowerPC G4 |
| Number of Cores | 1 | — |
| Data Bus Width | 32-bit (with 64-bit extension) | — |
| Maximum Clock Frequency | 500 MHz | — |
| Instruction Set | 32-bit PowerPC with AltiVec 128-bit SIMD | — |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltages | 2.5 V and 3.3 V | — |
| Operating Temperature (TJ) | 0C to 105C | — |
| Maximum Junction Temperature | 105C | — |
| Process Technology | 0.18 micrometer CMOS | — |
| L1 Instruction Cache | 32 Kbyte | — |
| L1 Data Cache | 32 Kbyte | — |
| L2 Cache Controller | Yes (external SRAM) | — |
| Package | 360-CBGA (FCCBGA, 25x25 mm) | 360-CBGA (25x25 mm) |
| Mounting Type | Surface Mount (flip-chip BGA) | Surface Mount |
| MSL Level | 3 | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Tray Quantity | Tray packaging | — |
| Core Processor | — | MPC74xx |
| Number of Cores / Bus Width | — | 1 Core, 32-bit |
| Speed | — | 500 MHz |
| Co-Processors / DSP | — | None |
| RAM Controllers | — | None |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | None |
| Ethernet | — | None |
| SATA | — | None |
| USB | — | None |
| Number of Terminals | — | 360 |
| Terminal Form | — | Ball |
| Package Code | — | HBGA |
| Package Shape | — | Square |