MPC7410HX500LE vs MPC7410RX500LE 비교
다음의 상세 나란히 비교: MPC7410HX500LE 제조: NXP Semiconductors 및 MPC7410RX500LE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MPC7410HX500LE | MPC7410RX500LE |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | NRND | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MPC7410HX500LE | — |
| Processor Family | PowerPC G4 (MPC74xx) | — |
| Core Architecture | Power Architecture with AltiVec SIMD | PowerPC G4 |
| Number of Cores | 1 | — |
| 데이터 버스 폭 | 32-bit (with 64-bit extension) | — |
| 최대 클록 주파수 | 500 MHz | — |
| Instruction Set | 32-bit PowerPC with AltiVec 128-bit SIMD | — |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltages | 2.5 V and 3.3 V | — |
| Operating Temperature (TJ) | 0C to 105C | — |
| Maximum Junction Temperature | 105C | — |
| Process Technology | 0.18 micrometer CMOS | — |
| L1 Instruction Cache | 32 Kbyte | — |
| L1 Data Cache | 32 Kbyte | — |
| L2 Cache Controller | Yes (external SRAM) | — |
| 패키지 | 360-CBGA (FCCBGA, 25x25 mm) | 360-CBGA (25x25 mm) |
| 실장 유형 | Surface Mount (flip-chip BGA) | Surface Mount |
| MSL 레벨 | 3 | — |
| RoHS 상태 | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Tray Quantity | Tray packaging | — |
| Core Processor | — | MPC74xx |
| Number of Cores / Bus Width | — | 1 Core, 32-bit |
| Speed | — | 500 MHz |
| Co-Processors / DSP | — | None |
| RAM Controllers | — | None |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | None |
| Ethernet | — | None |
| SATA | — | None |
| USB | — | None |
| Number of Terminals | — | 360 |
| Terminal Form | — | Ball |
| Package Code | — | HBGA |
| Package Shape | — | Square |