MPC7410HX500LE vs MPC7410RX500LE Comparação

Comparação detalhada lado a lado de MPC7410HX500LE por NXP Semiconductors e MPC7410RX500LE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC7410HX500LE MPC7410HX500LE - PowerPC G4 MPU 500MHz 360-CBGA | NXP

MPC7410HX500LE - PowerPC G4 MPU 500MHz 360-CBGA | NXP

MPC7410HX500LE Nrnd
NXP Semiconductors
MPC7410RX500LE MPC7410RX500LE - 500MHz PowerPC G4 MPU, 360-CBGA | NXP

MPC7410RX500LE - 500MHz PowerPC G4 MPU, 360-CBGA | NXP

MPC7410RX500LE Obsolete

Comparação de especificações

Parâmetro MPC7410HX500LE MPC7410RX500LE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) —
Part Number MPC7410HX500LE —
Processor Family PowerPC G4 (MPC74xx) —
Core Architecture Power Architecture with AltiVec SIMD PowerPC G4
Number of Cores 1 —
Largura do barramento de dados 32-bit (with 64-bit extension) —
Frequência máxima de clock 500 MHz —
Instruction Set 32-bit PowerPC with AltiVec 128-bit SIMD —
Core Supply Voltage 1.8 V —
I/O Supply Voltages 2.5 V and 3.3 V —
Operating Temperature (TJ) 0C to 105C —
Maximum Junction Temperature 105C —
Process Technology 0.18 micrometer CMOS —
L1 Instruction Cache 32 Kbyte —
L1 Data Cache 32 Kbyte —
L2 Cache Controller Yes (external SRAM) —
Encapsulamento 360-CBGA (FCCBGA, 25x25 mm) 360-CBGA (25x25 mm)
Tipo de montagem Surface Mount (flip-chip BGA) Surface Mount
Nível MSL 3 —
Status RoHS Compliant [DATA_NEEDED: RoHS compliance status]
Lead-Free Yes —
Tray Quantity Tray packaging —
Core Processor — MPC74xx
Number of Cores / Bus Width — 1 Core, 32-bit
Speed — 500 MHz
Co-Processors / DSP — None
RAM Controllers — None
Graphics Acceleration — No
Display & Interface Controllers — None
Ethernet — None
SATA — None
USB — None
Number of Terminals — 360
Terminal Form — Ball
Package Code — HBGA
Package Shape — Square

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