MPC745BVT300LE vs MPC755BVT300LE Comparison

Detailed side-by-side comparison of MPC745BVT300LE by NXP Semiconductors and MPC755BVT300LE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC745BVT300LE MPC745BVT300LE - PowerPC MPU 300MHz 32-Bit 255-FCPBGA | NXP

MPC745BVT300LE - PowerPC MPU 300MHz 32-Bit 255-FCPBGA | NXP

MPC745BVT300LE Nrnd

Specification Comparison

Parameter MPC745BVT300LE MPC755BVT300LE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Family MPC7xx (PowerPC G4) —
Core Architecture PowerPC Book E, 32-bit —
Core Clock Speed 300 MHz —
Process Technology 0.18 micrometer CMOS —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache Interface External (cache-as-RAM supported) —
External Data Bus Width 64-bit —
Address Bus Width 32-bit —
Core Supply Voltage (Vdd) 1.55 V to 1.65 V (1.6 V nominal) —
I/O Supply Voltage (Vdd_IO) 3.135 V to 3.465 V (3.3 V nominal) —
Operating Temperature (TA) 0C to 105C —
Package 255-FCPBGA (21x21 mm) —
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level [DATA_NEEDED: MSL rating] —
JTAG / Debug Port IEEE 1149.1 JTAG + COP —
Endianness Big-endian and Little-endian (selectable) —
RoHS Status [DATA_NEEDED: per datasheet] —
Manufacturer — NXP Semiconductors (formerly Freescale)
Product Family — MPC7xx (PowerPC)
Architecture — RISC, PowerPC
Core Count — 1
Data Bus Width — 64-bit
Instruction Width — 32-bit
Maximum Clock Frequency — 300 MHz
Supply Voltage — 2 V / 2.5 V / 3.3 V
Package Type — FCBGA (Flip-Chip BGA)
Pin/Ball Count — 360
Package Dimensions — 25 x 25 mm
Ball Pitch — 1.27 mm
Operating Temperature — 0C to +105C
Lead-Free / RoHS — Lead-free, RoHS compliant
L1 Cache — Integrated (instruction + data)
MMU — Yes (demand-paged virtual memory)
Power Modes — Nap, Doze, Sleep
Tray Packaging — Yes (per Arrow listing)

Datasheets & Resources

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