MPC745BVT300LE vs MPC755BVT300LE Comparación
Comparación detallada lado a lado de MPC745BVT300LE por NXP Semiconductors y MPC755BVT300LE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC755BVT300LE - PowerPC MPU 300MHz 360-FCBGA | NXP Semiconductors
MPC755BVT300LE NrndComparación de especificaciones
| Parámetro | MPC745BVT300LE | MPC755BVT300LE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Family | MPC7xx (PowerPC G4) | — |
| Core Architecture | PowerPC Book E, 32-bit | — |
| Core Clock Speed | 300 MHz | — |
| Process Technology | 0.18 micrometer CMOS | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache Interface | External (cache-as-RAM supported) | — |
| External Data Bus Width | 64-bit | — |
| Address Bus Width | 32-bit | — |
| Core Supply Voltage (Vdd) | 1.55 V to 1.65 V (1.6 V nominal) | — |
| I/O Supply Voltage (Vdd_IO) | 3.135 V to 3.465 V (3.3 V nominal) | — |
| Operating Temperature (TA) | 0C to 105C | — |
| Encapsulado | 255-FCPBGA (21x21 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| JTAG / Debug Port | IEEE 1149.1 JTAG + COP | — |
| Endianness | Big-endian and Little-endian (selectable) | — |
| Estado RoHS | [DATA_NEEDED: per datasheet] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Family | — | MPC7xx (PowerPC) |
| Architecture | — | RISC, PowerPC |
| Core Count | — | 1 |
| Ancho del bus de datos | — | 64-bit |
| Instruction Width | — | 32-bit |
| Frecuencia de reloj máxima | — | 300 MHz |
| Tensión de alimentación | — | 2 V / 2.5 V / 3.3 V |
| Package Type | — | FCBGA (Flip-Chip BGA) |
| Pin/Ball Count | — | 360 |
| Package Dimensions | — | 25 x 25 mm |
| Ball Pitch | — | 1.27 mm |
| Temperatura de funcionamiento | — | 0C to +105C |
| Lead-Free / RoHS | — | Lead-free, RoHS compliant |
| L1 Cache | — | Integrated (instruction + data) |
| MMU | — | Yes (demand-paged virtual memory) |
| Power Modes | — | Nap, Doze, Sleep |
| Tray Packaging | — | Yes (per Arrow listing) |