MPC745BVT300LE vs MPC755BVT300LE Comparaison
Comparaison détaillée côte à côte de MPC745BVT300LE par NXP Semiconductors et MPC755BVT300LE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC755BVT300LE - PowerPC MPU 300MHz 360-FCBGA | NXP Semiconductors
MPC755BVT300LE NrndComparaison des spécifications
| Paramètre | MPC745BVT300LE | MPC755BVT300LE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Family | MPC7xx (PowerPC G4) | — |
| Core Architecture | PowerPC Book E, 32-bit | — |
| Core Clock Speed | 300 MHz | — |
| Process Technology | 0.18 micrometer CMOS | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache Interface | External (cache-as-RAM supported) | — |
| External Data Bus Width | 64-bit | — |
| Address Bus Width | 32-bit | — |
| Core Supply Voltage (Vdd) | 1.55 V to 1.65 V (1.6 V nominal) | — |
| I/O Supply Voltage (Vdd_IO) | 3.135 V to 3.465 V (3.3 V nominal) | — |
| Operating Temperature (TA) | 0C to 105C | — |
| Boîtier | 255-FCPBGA (21x21 mm) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| JTAG / Debug Port | IEEE 1149.1 JTAG + COP | — |
| Endianness | Big-endian and Little-endian (selectable) | — |
| Statut RoHS | [DATA_NEEDED: per datasheet] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Family | — | MPC7xx (PowerPC) |
| Architecture | — | RISC, PowerPC |
| Core Count | — | 1 |
| Largeur du bus de données | — | 64-bit |
| Instruction Width | — | 32-bit |
| Fréquence d'horloge maximale | — | 300 MHz |
| Tension d'alimentation | — | 2 V / 2.5 V / 3.3 V |
| Package Type | — | FCBGA (Flip-Chip BGA) |
| Pin/Ball Count | — | 360 |
| Package Dimensions | — | 25 x 25 mm |
| Ball Pitch | — | 1.27 mm |
| Température de fonctionnement | — | 0C to +105C |
| Lead-Free / RoHS | — | Lead-free, RoHS compliant |
| L1 Cache | — | Integrated (instruction + data) |
| MMU | — | Yes (demand-paged virtual memory) |
| Power Modes | — | Nap, Doze, Sleep |
| Tray Packaging | — | Yes (per Arrow listing) |