MPC8250ACZQIHBC vs MPC8250AZQIHBC Comparison
Detailed side-by-side comparison of MPC8250ACZQIHBC by NXP Semiconductors and MPC8250AZQIHBC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC Obsolete
Specification Comparison
| Parameter | MPC8250ACZQIHBC | MPC8250AZQIHBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $99.50 | $47.80 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | — |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | PowerPC G2 (MPC82xx / PowerQUICC II) |
| Clock Speed | 200 MHz | — |
| Number of Cores | 1 (CPU) + 1 CPM | 1 |
| Data Bus Width | 64-Bit | 32-bit |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Operating Temperature | -40C to +105C (industrial) | — |
| Package Type | TEPBGA / Plastic BGA | 516-Pin TEPBGA |
| Pin Count | 516 | — |
| Package Dimensions | 27 x 27 mm | 27 mm x 27 mm |
| Ball Pitch | 1.0 mm | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| MSL Level | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Lead Free | Yes (per datasheet package code) | — |
| Maximum Clock Frequency | — | 200 MHz |
| Supply Voltage | — | 3.3 V |
| External Bus Width | — | 64-bit |
| Operating Temperature Grade | — | Commercial |
| Integrated Peripherals | — | CPM (FCC/MCC/SCC), 10/100 Ethernet MAC |
| RoHS Status | — | Compliant |
| Lead-Free | — | Yes |