MPC8250AZQIHBC - PowerQUICC II MPC82xx 200MHz MPU | NXP
MPN: MPC8250AZQIHBC ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $90.58 | $90.58 |
| 10 | $78.5 | $785.00 |
| 100 | $65.2 | $6,520.00 |
| 500 | $54.1 | $27,050.00 |
| 1,000 | $47.8 | $47,800.00 |
MPC8250AZQIHBC Overview
A microprocessor (MPU) is the central processing unit of an embedded system, executing instructions fetched from memory and coordinating peripheral traffic. The MPC82xx family sits in the hierarchy of NXP PowerQUICC communications processors: MPU -> embedded microprocessor -> communications processor -> PowerQUICC II -> PowerPC G2 -> 32-bit RISC core -> semiconductor. This positioning makes the part especially suitable for networking, telecom, and industrial control applications where deterministic peripheral behavior matters as much as raw CPU throughput.
Key differentiating features include the integrated communications processor module (CPM) with multiple FCCs (Fast Communications Controllers), MCCs, SCCs, and a 10/100 Ethernet MAC, all sharing DMA access to the host CPU. The part exposes a 32-bit PowerPC data path, 603e-class instruction set, and an external bus width of 64 bits. The 516-pin TEPBGA (Plastic Enhanced BGA) package measures 27 mm x 27 mm and provides extensive I/O and address pins for external SDRAM, Flash, and peripheral expansion. The operating temperature grade marked by the 'Z' suffix is commercial.
Typical applications include routers, LAN/WAN switches, DSLAM line cards, industrial control boards, and legacy telecom backplanes. The combination of on-chip peripherals and PowerPC core reduces board area versus designs that pair a discrete CPU with an external PCI bridge. Designers migrating from earlier PowerQUICC I (MPC860) parts benefit from binary-compatible instruction sets with higher clock rates and additional peripheral channels.
When designing with this part, careful attention to power sequencing and decoupling is mandatory because the MPC8250 has multiple supply rails (core and I/O). The 516-pin BGA requires X-ray inspection and controlled reflow profiles; PCB land pattern and trace routing must follow NXP application note guidelines for high-speed 60x-class buses to avoid signal integrity issues on the memory interface.
Drop-in alternatives for MPC8250AZQIHBC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8250AZQIHBC (same form factor and footprint) — differing in Package Type, Data Bus Width, Core, Core Architecture, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8250AVRIHBC
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →MPC8250ACZQIHBC
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →MPC8250ACVRIHBC
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8270CVRMIBA
✅ Drop-In✓ In Stock
$88.75 / Unit
View Datasheet →MPC8247VRTIEA
✅ Drop-In✓ In Stock
$58.25 / Unit
View Datasheet →MPC8250AZQIHBC Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC G2 (MPC82xx / PowerQUICC II) |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 200 MHz |
| Process Technology | 0.25 um CMOS |
| Supply Voltage | 3.3 V |
| Package Type | 516-Pin TEPBGA |
| Package Dimensions | 27 mm x 27 mm |
| External Bus Width | 64-bit |
| Operating Temperature Grade | Commercial |
| Integrated Peripherals | CPM (FCC/MCC/SCC), 10/100 Ethernet MAC |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
MPC8250AZQIHBC 27 mm x 27 mm Pin Configuration Guide
Pin configuration for MPC8250AZQIHBC (27 mm x 27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8250AZQIHBC.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8250AZQIHBC is suitable for 6 applications: Telecom Router Control Plane, LAN/WAN Switch Line Card, DSLAM Line Card Processor, Industrial Control SBC, Legacy Telecom Backplane Interface, Network Print Server and Embedded NAS.
Telecom Router Control Plane
The MPC8250AZQIHBC suits telecom router control plane designs where deterministic peripheral behavior and an integrated CPM reduce BOM cost. Its 200 MHz PowerPC G2 core runs routing protocols while the on-chip FCC and Ethernet MAC terminate multiple WAN links. The 516-pin TEPBGA exposes enough chip-select lines for SDRAM plus Flash plus boot ROM, and the 64-bit external bus sustains high-bandwidth packet forwarding without external bridge silicon.
Recommended
LAN/WAN Switch Line Card
The MPC8250AZQIHBC integrates a 10/100 Ethernet MAC and multiple SCCs, allowing it to drive Layer 2 switch line cards with on-chip PHY interfaces and serial glue logic. Its 32-bit PowerPC core runs MAC-layer forwarding tables, and the CPM offloads DMA to free CPU cycles. Compared with discrete CPU+ASIC designs, this part shrinks the BOM and consolidates interrupt handling on a single silicon die.
Recommended
DSLAM Line Card Processor
The MPC8250AZQIHBC handles DSLAM line-card MAC processing at 200 MHz while its CPM terminates ATM AAL and HDLC traffic to the uplink. The 516-TEPBGA 27x27 mm footprint fits standard ATCA line-card geometries and exposes sufficient GPIO for line-card management I2C and SPI buses. Using the same part across line-card and uplink-card slots simplifies firmware reuse and maintenance across the DSLAM chassis.
Recommended
Industrial Control SBC
The MPC8250AZQIHBC powers industrial single-board computers by combining a 200 MHz PowerPC host CPU with deterministic DMA-driven peripherals. Designers use the SCCs for RS-485 field-bus, the Ethernet MAC for management, and the FCCs for high-speed synchronous links to FPGA co-processors. The commercial temperature grade suits factory-floor enclosures, while the same package supports industrial screens via the 'V' suffix variant.
Recommended
Legacy Telecom Backplane Interface
The MPC8250AZQIHBC serves legacy backplane interface cards in telecom racks that need HDLC, UART, and TDM traffic aggregation. The CPM arbitrates DMA for multiple channels without burdening the CPU, and the 64-bit external memory bus sustains aggregate throughput across all channels. Engineers maintaining installed base equipment can sustain production using Rochester Electronics inventory and same-family NXP drop-in upgrades.
Recommended
Network Print Server and Embedded NAS
The MPC8250AZQIHBC fits embedded NAS and print-server appliances by combining a PowerPC core with on-chip Ethernet, serial, and parallel DMA. The 200 MHz clock runs lightweight TCP/IP stacks while the FCC handles high-throughput data pipes to the storage controller. Designers leverage the 64-bit SDRAM bus to buffer large I/O streams without external bridge logic, reducing board area versus discrete CPU designs.
Recommended
Recommended Products Summary
Engineering reference data for MPC8250AZQIHBC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8250AVRIHBC | MPC8250ACZQIHBC | MPC8250ACVRIHBC | MPC8270CVRMIBA | MPC8247VRTIEA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA - same family package | 516-TEPBGA - same family package |
| Maximum Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 266-450 MHz | 266 MHz |
| Core Architecture | PowerPC G2 (MPC82xx) | PowerPC G2 (MPC82xx) | PowerPC G2 (MPC82xx) | PowerPC G2 (MPC82xx) | PowerPC G2 (MPC82xx HiPerMOS7) | PowerPC G2 (MPC82xx) |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.13 um HiPerMOS7 | 0.13 um HiPerMOS7 |
| Temperature Grade | Commercial (Z suffix) | Industrial (V suffix) | Commercial (Z suffix) | Industrial (V suffix) | Industrial (V suffix) | Industrial (V suffix) |
| External Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.8 V core / 3.3 V I/O | 1.8 V core / 3.3 V I/O |
Key Differentiators
- Same-family industrial-temperature drop-in (vs MPC8250AVRIHBC)
- Higher clock speed options in same package (vs MPC8270CVRMIBA)
- Lower-power HiPerMOS7 successor available (vs MPC8270CVRMIBA)
Design Notes
The MPC8250AZQIHBC requires multiple supply rails: a 3.3 V I/O rail, a separate 1.5-1.8 V core rail, and PLL analog supplies. Power sequencing mandates core voltage rise before or simultaneously with I/O voltage to avoid latch-up. Use a sequencer IC such as the NMC TPS3808 or similar supervisor with adjustable delay to enforce the required turn-on order. Place bulk ceramic and tantalum capacitors within 1 inch of each BGA power pin pair to suppress transient di/dt loads during CPM DMA bursts.
Estimated: at core voltage 1.8 V and 200 MHz with all CPM channels active, worst-case core power reaches roughly 2.5-3.5 W for this 0.25 um part. The TEPBGA 27x27 mm substrate offers a moderate theta_JA of about 12-15 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 30-50 C above ambient. Provide a thermal pad stitched with a via array and at least 4 inner copper planes for thermal spreading in production designs.
Route the 64-bit external memory bus on the top or second layer with 50-ohm controlled impedance and length matching within 100 mil across byte lanes. Use 1.0 mm-pitch microvia stack-ups because standard 1.6 mm 4-layer boards cannot escape the 516-TEPBGA at 1.27 mm pitch without dog-bone fanouts that exceed acceptable stub length. Keep clock traces shorter than address and data traces, and guard the SDRAM clock with ground-side reference to minimize crosstalk.
The MPC8250AZQIHBC memory bus runs at up to 100 MHz externally, so apply series termination near the driver side and place SDRAM DIMMs/SODIMMs within 2 inches of the BGA. Verify SI with TDR measurements after PCB fab to ensure impedance stays within 50 +/- 10 percent. For long backplane interfaces through the FCCs, use AC-coupled differential pairs with matched-length routing.
Avoid using the MPC8250AZQIHBC on new designs in 2026 because the part is in obsolete or last-time-buy status per NXP lifecycle. Engineers maintaining installed base should specify Rochester Electronics or other authorized-channel stock and verify date codes. Mixing different silicon revisions in the same chassis can cause JTAG ID mismatch and break firmware update paths; keep a single revision per board SKU.
Compliance Information
RoHS and lead-free status confirmed by Rochester Electronics product listings; AEC-Q100 not applicable for non-automotive MPU; halogen-free status not explicitly stated in available datasheet sources.
