MPC8250ACZQIHBC vs MPC8250AZQIHBC Vergleich
Detaillierter Direktvergleich von MPC8250ACZQIHBC von NXP Semiconductors und MPC8250AZQIHBC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC Obsolete
Spezifikationsvergleich
| Parameter | MPC8250ACZQIHBC | MPC8250AZQIHBC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $99,50 | $47,80 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | — |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | PowerPC G2 (MPC82xx / PowerQUICC II) |
| Clock Speed | 200 MHz | — |
| Number of Cores | 1 (CPU) + 1 CPM | 1 |
| Datenbusbreite | 64-Bit | 32-bit |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Betriebstemperatur | -40C to +105C (industrial) | — |
| Package Type | TEPBGA / Plastic BGA | 516-Pin TEPBGA |
| Pin-Anzahl | 516 | — |
| Package Dimensions | 27 x 27 mm | 27 mm x 27 mm |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| MSL-Level | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Lead Free | Yes (per datasheet package code) | — |
| Maximale Taktfrequenz | — | 200 MHz |
| Versorgungsspannung | — | 3.3 V |
| External Bus Width | — | 64-bit |
| Operating Temperature Grade | — | Commercial |
| Integrated Peripherals | — | CPM (FCC/MCC/SCC), 10/100 Ethernet MAC |
| RoHS-Status | — | Compliant |
| Lead-Free | — | Yes |