MPC8250AZQIHBC vs MPC8250ACZQIHBC Comparison
Detailed side-by-side comparison of MPC8250AZQIHBC by NXP Semiconductors and MPC8250ACZQIHBC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteSpecification Comparison
| Parameter | MPC8250AZQIHBC | MPC8250ACZQIHBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $47.80 | $99.50 |
| Core Architecture | PowerPC G2 (MPC82xx / PowerQUICC II) | PowerPC 603e, 32-Bit RISC |
| Number of Cores | 1 | 1 (CPU) + 1 CPM |
| Data Bus Width | 32-bit | 64-Bit |
| Maximum Clock Frequency | 200 MHz | — |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| Supply Voltage | 3.3 V | — |
| Package Type | 516-Pin TEPBGA | TEPBGA / Plastic BGA |
| Package Dimensions | 27 mm x 27 mm | 27 x 27 mm |
| External Bus Width | 64-bit | — |
| Operating Temperature Grade | Commercial | — |
| Integrated Peripherals | CPM (FCC/MCC/SCC), 10/100 Ethernet MAC | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| RoHS Status | Compliant | — |
| Lead-Free | Yes | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC II |
| Core Processor | — | PowerPC G2 |
| Clock Speed | — | 200 MHz |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Operating Temperature | — | -40C to +105C (industrial) |
| Pin Count | — | 516 |
| Ball Pitch | — | 1.0 mm |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |