MPC8250AZQIHBC vs MPC8250ACZQIHBC Vergleich
Detaillierter Direktvergleich von MPC8250AZQIHBC von NXP Semiconductors und MPC8250ACZQIHBC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteSpezifikationsvergleich
| Parameter | MPC8250AZQIHBC | MPC8250ACZQIHBC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $47,80 | $99,50 |
| Core Architecture | PowerPC G2 (MPC82xx / PowerQUICC II) | PowerPC 603e, 32-Bit RISC |
| Number of Cores | 1 | 1 (CPU) + 1 CPM |
| Datenbusbreite | 32-bit | 64-Bit |
| Maximale Taktfrequenz | 200 MHz | — |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| Versorgungsspannung | 3.3 V | — |
| Package Type | 516-Pin TEPBGA | TEPBGA / Plastic BGA |
| Package Dimensions | 27 mm x 27 mm | 27 x 27 mm |
| External Bus Width | 64-bit | — |
| Operating Temperature Grade | Commercial | — |
| Integrated Peripherals | CPM (FCC/MCC/SCC), 10/100 Ethernet MAC | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC II |
| Core Processor | — | PowerPC G2 |
| Clock Speed | — | 200 MHz |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Betriebstemperatur | — | -40C to +105C (industrial) |
| Pin-Anzahl | — | 516 |
| Ball Pitch | — | 1.0 mm |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |