MPC8255ACZUMHBB vs MPC8250ACZUMHBC Comparison
Detailed side-by-side comparison of MPC8255ACZUMHBB by NXP Semiconductors and MPC8250ACZUMHBC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoleteNXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ Last Time BuySpecification Comparison
| Parameter | MPC8255ACZUMHBB | MPC8250ACZUMHBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $97.50 | $85.00 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | PowerQUICC II HIP4 | MPC82xx (PowerQUICC II) |
| Core Architecture | PowerPC G2 | — |
| Data Bus Width | 64-Bit | 32-bit internal / 64-bit external |
| Core Supply Voltage | 1.8 V | — |
| Maximum Clock Speed | 266 MHz | — |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Instruction Set | 32-Bit RISC | — |
| Core | MPC82xx | — |
| Package Type | T-BGA | — |
| Pin/Ball Count | 480 | — |
| Package Size | 37.50 x 37.50 mm | — |
| Package Height | 1.55 mm | — |
| Ball Pitch | 1.27 mm | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Process Technology | 0.25 micron (HiP4) silicon revision | 0.25 micron |
| Integrated CPM | Yes (dual communications processor modules) | — |
| Ethernet MACs | Dual 10/100 MAC | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Core Processor | — | PowerPC G2 |
| Co-Processors / DSP | — | Communications; RISC CPM |
| Speed | — | 266 MHz |
| Supply Voltage (I/O) | — | 3.3 V |
| Core Voltage | — | 1.8 V |
| Package / Case | — | 480-TBGA (37.5 x 37.5 mm) |
| Pin Count | — | 480 |
| Architecture | — | RISC |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Lifecycle Status | — | Last Time Buy (NXP EOL announced) |
| Lead Free | — | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) |