MPC8255ACZUMHBB vs MPC8250ACZUMHBC Comparación
Comparación detallada lado a lado de MPC8255ACZUMHBB por NXP Semiconductors y MPC8250ACZUMHBC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoleteNXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ Última compraComparación de especificaciones
| Parámetro | MPC8255ACZUMHBB | MPC8250ACZUMHBC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $97,50 | $85,00 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | PowerQUICC II HIP4 | MPC82xx (PowerQUICC II) |
| Core Architecture | PowerPC G2 | — |
| Ancho del bus de datos | 64-Bit | 32-bit internal / 64-bit external |
| Core Supply Voltage | 1.8 V | — |
| Maximum Clock Speed | 266 MHz | — |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Instruction Set | 32-Bit RISC | — |
| Core | MPC82xx | — |
| Package Type | T-BGA | — |
| Pin/Ball Count | 480 | — |
| Package Size | 37.50 x 37.50 mm | — |
| Package Height | 1.55 mm | — |
| Ball Pitch | 1.27 mm | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Process Technology | 0.25 micron (HiP4) silicon revision | 0.25 micron |
| Integrated CPM | Yes (dual communications processor modules) | — |
| Ethernet MACs | Dual 10/100 MAC | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Core Processor | — | PowerPC G2 |
| Co-Processors / DSP | — | Communications; RISC CPM |
| Speed | — | 266 MHz |
| Supply Voltage (I/O) | — | 3.3 V |
| Core Voltage | — | 1.8 V |
| Encapsulado / Carcasa | — | 480-TBGA (37.5 x 37.5 mm) |
| Recuento de pines | — | 480 |
| Architecture | — | RISC |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Estado del ciclo de vida | — | Last Time Buy (NXP EOL announced) |
| Lead Free | — | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) |