MPC8255ACZUMHBB vs MPC8250ACZUMHBC Comparaison
Comparaison détaillée côte à côte de MPC8255ACZUMHBB par NXP Semiconductors et MPC8250ACZUMHBC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoleteNXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC8255ACZUMHBB | MPC8250ACZUMHBC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $97,50 | $85,00 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | PowerQUICC II HIP4 | MPC82xx (PowerQUICC II) |
| Core Architecture | PowerPC G2 | — |
| Largeur du bus de données | 64-Bit | 32-bit internal / 64-bit external |
| Core Supply Voltage | 1.8 V | — |
| Maximum Clock Speed | 266 MHz | — |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Instruction Set | 32-Bit RISC | — |
| Core | MPC82xx | — |
| Package Type | T-BGA | — |
| Pin/Ball Count | 480 | — |
| Package Size | 37.50 x 37.50 mm | — |
| Package Height | 1.55 mm | — |
| Ball Pitch | 1.27 mm | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Process Technology | 0.25 micron (HiP4) silicon revision | 0.25 micron |
| Integrated CPM | Yes (dual communications processor modules) | — |
| Ethernet MACs | Dual 10/100 MAC | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Core Processor | — | PowerPC G2 |
| Co-Processors / DSP | — | Communications; RISC CPM |
| Speed | — | 266 MHz |
| Supply Voltage (I/O) | — | 3.3 V |
| Core Voltage | — | 1.8 V |
| Boîtier / Format | — | 480-TBGA (37.5 x 37.5 mm) |
| Nombre de broches | — | 480 |
| Architecture | — | RISC |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Statut du cycle de vie | — | Last Time Buy (NXP EOL announced) |
| Lead Free | — | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) |