MPC8255ACZUMHBB vs MPC8250ACZUMHBC 对比
详细并排对比 MPC8255ACZUMHBB 出自 NXP Semiconductors 和 MPC8250ACZUMHBC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB Obsolete规格对比
| 参数 | MPC8255ACZUMHBB | MPC8250ACZUMHBC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $97.50 | $85.00 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | PowerQUICC II HIP4 | MPC82xx (PowerQUICC II) |
| Core Architecture | PowerPC G2 | — |
| 数据总线宽度 | 64-Bit | 32-bit internal / 64-bit external |
| Core Supply Voltage | 1.8 V | — |
| Maximum Clock Speed | 266 MHz | — |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Instruction Set | 32-Bit RISC | — |
| Core | MPC82xx | — |
| Package Type | T-BGA | — |
| Pin/Ball Count | 480 | — |
| Package Size | 37.50 x 37.50 mm | — |
| Package Height | 1.55 mm | — |
| Ball Pitch | 1.27 mm | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Process Technology | 0.25 micron (HiP4) silicon revision | 0.25 micron |
| Integrated CPM | Yes (dual communications processor modules) | — |
| Ethernet MACs | Dual 10/100 MAC | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Core Processor | — | PowerPC G2 |
| Co-Processors / DSP | — | Communications; RISC CPM |
| Speed | — | 266 MHz |
| Supply Voltage (I/O) | — | 3.3 V |
| Core Voltage | — | 1.8 V |
| 封装 / 外壳 | — | 480-TBGA (37.5 x 37.5 mm) |
| 引脚数量 | — | 480 |
| Architecture | — | RISC |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| 生命周期状态 | — | Last Time Buy (NXP EOL announced) |
| Lead Free | — | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) |