MPC8270CVRMIBA vs MPC8250ACZQIHBC Comparison
Detailed side-by-side comparison of MPC8270CVRMIBA by NXP Semiconductors and MPC8250ACZQIHBC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ End of LifeNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteSpecification Comparison
| Parameter | MPC8270CVRMIBA | MPC8250ACZQIHBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $88.75 | $99.50 |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | 200 MHz |
| Data Bus Width | 64-Bit | 64-Bit |
| Supply Voltage (Core) | 1.5 V | 1.8 V |
| I/O Voltage | 3.3 V | — |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | TEPBGA / Plastic BGA |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Operating Temperature | -40 C to +105 C | -40C to +105C (industrial) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | — |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| MSL Level | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (168 hours) |
| RoHS Status | Lead-Free / Compliant (per package marking) | — |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Manufacturer | — | NXP Semiconductors |
| Core Processor | — | PowerPC G2 |
| Core Architecture | — | PowerPC 603e, 32-Bit RISC |
| Number of Cores | — | 1 (CPU) + 1 CPM |
| Supply Voltage (I/O) | — | 3.3 V |
| Pin Count | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.25 um CMOS |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |