MPC8270CVRMIBA vs MPC8250ACZQIHBC Comparaison
Comparaison détaillée côte à côte de MPC8270CVRMIBA par NXP Semiconductors et MPC8250ACZQIHBC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ Fin de vieNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteComparaison des spécifications
| Paramètre | MPC8270CVRMIBA | MPC8250ACZQIHBC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $88,75 | $99,50 |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | 200 MHz |
| Largeur du bus de données | 64-Bit | 64-Bit |
| Supply Voltage (Core) | 1.5 V | 1.8 V |
| I/O Voltage | 3.3 V | — |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | TEPBGA / Plastic BGA |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Température de fonctionnement | -40 C to +105 C | -40C to +105C (industrial) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | — |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| Niveau MSL | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (168 hours) |
| Statut RoHS | Lead-Free / Compliant (per package marking) | — |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Manufacturer | — | NXP Semiconductors |
| Core Processor | — | PowerPC G2 |
| Core Architecture | — | PowerPC 603e, 32-Bit RISC |
| Number of Cores | — | 1 (CPU) + 1 CPM |
| Supply Voltage (I/O) | — | 3.3 V |
| Nombre de broches | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.25 um CMOS |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |