MPC8270CVRMIBA vs MPC8250ACZQIHBC Vergleich
Detaillierter Direktvergleich von MPC8270CVRMIBA von NXP Semiconductors und MPC8250ACZQIHBC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ AbgekündigtNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteSpezifikationsvergleich
| Parameter | MPC8270CVRMIBA | MPC8250ACZQIHBC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $88,75 | $99,50 |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | 200 MHz |
| Datenbusbreite | 64-Bit | 64-Bit |
| Supply Voltage (Core) | 1.5 V | 1.8 V |
| I/O Voltage | 3.3 V | — |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | TEPBGA / Plastic BGA |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Betriebstemperatur | -40 C to +105 C | -40C to +105C (industrial) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | — |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| MSL-Level | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (168 hours) |
| RoHS-Status | Lead-Free / Compliant (per package marking) | — |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Manufacturer | — | NXP Semiconductors |
| Core Processor | — | PowerPC G2 |
| Core Architecture | — | PowerPC 603e, 32-Bit RISC |
| Number of Cores | — | 1 (CPU) + 1 CPM |
| Supply Voltage (I/O) | — | 3.3 V |
| Pin-Anzahl | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.25 um CMOS |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |