MPC8308CZQAGDA vs MPC8308CZQAGD Comparison
Detailed side-by-side comparison of MPC8308CZQAGDA by NXP Semiconductors and MPC8308CZQAGD by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8308CZQAGDA - PowerQUICC II Pro SoC 400MHz | NXP Semiconductors
MPC8308CZQAGDA ✗ End of LifeNXP Semiconductors
MPC8308CZQAGD - PowerQUICC II Pro 400MHz SoC | NXP MAP-BGA
MPC8308CZQAGD ✓ ActiveSpecification Comparison
| Parameter | MPC8308CZQAGDA | MPC8308CZQAGD |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $25.60 | $18.10 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro | — |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | — |
| Core Architecture | 32-Bit Power Architecture | Power Architecture e300c3 |
| Maximum CPU Frequency | 400 MHz | 400 MHz |
| Package / Case | 473-MAPBGA (19x19 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature Range | -40C to +105C | -40C to +105C (Industrial) |
| Memory Controller | DDR2 (integrated) | DDR1/DDR2 |
| Integrated Ethernet | Dual Gigabit Ethernet MACs | — |
| PCI Express Support | Yes (integrated) | — |
| USB Support | USB 2.0 (integrated) | — |
| Part Status | End of Life (EOL) | — |
| RoHS Status | Compliant | Compliant (lead-free) |
| Supply Voltage | [DATA_NEEDED: core and I/O rail voltages] | — |
| L1 Instruction Cache | 16 KB | 16 KB |
| L1 Data Cache | 16 KB | 16 KB |
| Product Family | — | PowerQUICC II Pro (MPC8308) |
| Core Count | — | 1 |
| Data Bus Width | — | 32-bit |
| Integrated SRAM | — | 256 KB |
| Ethernet MACs | — | 2x 10/100/1000 Mbps (GMII/RGMII) |
| USB Controller | — | USB 2.0 High-Speed Host/Device/OTG |
| PCI Express | — | 1x PCIe endpoint |
| Communications Engine | — | QUICC Engine |
| Package | — | 473-ball MAP-BGA (19x19) |
| Core Voltage | — | 1.0 V |
| I/O Voltages | — | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 0.09 um |
| Packaging Type | — | Tray |
| MSL Level | — | 3 |