MPC8308CZQAGDA vs MPC8308CZQAGD Vergleich
Detaillierter Direktvergleich von MPC8308CZQAGDA von NXP Semiconductors und MPC8308CZQAGD von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8308CZQAGDA - PowerQUICC II Pro SoC 400MHz | NXP Semiconductors
MPC8308CZQAGDA ✗ Abgekündigt
Spezifikationsvergleich
| Parameter | MPC8308CZQAGDA | MPC8308CZQAGD |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,60 | $18,10 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro | — |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | — |
| Core Architecture | 32-Bit Power Architecture | Power Architecture e300c3 |
| Maximum CPU Frequency | 400 MHz | 400 MHz |
| Gehäuse / Bauform | 473-MAPBGA (19x19 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperaturbereich | -40C to +105C | -40C to +105C (Industrial) |
| Memory Controller | DDR2 (integrated) | DDR1/DDR2 |
| Integrated Ethernet | Dual Gigabit Ethernet MACs | — |
| PCI Express Support | Yes (integrated) | — |
| USB Support | USB 2.0 (integrated) | — |
| Part Status | End of Life (EOL) | — |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Versorgungsspannung | [DATA_NEEDED: core and I/O rail voltages] | — |
| L1 Instruction Cache | 16 KB | 16 KB |
| L1 Data Cache | 16 KB | 16 KB |
| Product Family | — | PowerQUICC II Pro (MPC8308) |
| Core Count | — | 1 |
| Datenbusbreite | — | 32-bit |
| Integrated SRAM | — | 256 KB |
| Ethernet MACs | — | 2x 10/100/1000 Mbps (GMII/RGMII) |
| USB Controller | — | USB 2.0 High-Speed Host/Device/OTG |
| PCI Express | — | 1x PCIe endpoint |
| Communications Engine | — | QUICC Engine |
| Gehäuse | — | 473-ball MAP-BGA (19x19) |
| Core Voltage | — | 1.0 V |
| I/O Voltages | — | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 0.09 um |
| Packaging Type | — | Tray |
| MSL-Level | — | 3 |